| Allicdata Part #: | ATS-02C-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-02C-24-C3-R0 |
| Price: | $ 5.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.85793 |
| 30 +: | $ 4.58808 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal management is a crucial aspect of many applications, and heat sinks are commonly used as a low-cost solution for dissipating heat efficiently. The ATS-02C-24-C3-R0 is a commercially available heat sink manufactured by Alpha Thermal Solutions, Inc. and is designed to meet the demands of applications requiring high performance heat dissipation.
Description
The ATS-02C-24-C3-R0 is constructed from a single-piece extruded aluminum alloy body, plated with thermally conductive nickel-chrome. It also features an anodized finish for corrosion protection and includes mounting hardware and spring clips. The dimensions of the heat sink are 85mm x 50mm x 25mm, and it has 24 fins which increase the surface area available for heat dissipation.
Application Field
The ATS-02C-24-C3-R0 is suitable for use in areas requiring thermally intensive power components, such as electric vehicles and industrial equipment. It can also be used in the automotive, aerospace, audio, and computer sectors for applications such as 3-D graphics cards and power diodes. Additionally, this heat sink is suitable for use in hot spot mitigation designs that require the removal of high heat fluxes.
Working Principle
The ATS-02C-24-C3-R0 operates on the principle that heat transfer is maximized when there is a large surface area in contact with a coolant. The large surface area of the heat sink provides the necessary radiative dissipation area for removing heat from the component or device that is in need of thermal management. The anodized finish of the heat sink also increases its radiative coefficient, promoting conduction and convection cooling.
As the heated air rises from the cooled surface, the convection process draws cooler air across the heat sink to maintain a constant thermal equilibrium. The use of spring clips increases the thermal performance by applying pressure to the heat sink and clamping it firmly onto the component.
The ATS-02C-24-C3-R0 is a solution for cost-effective and efficient thermal management in any application. Its high thermal capacity and efficient operation make it suitable for powering components in a variety of industries, while its durable construction ensures a long service life.
The specific data is subject to PDF, and the above content is for reference