| Allicdata Part #: | ATS-02C-28-C1-R0-ND |
| Manufacturer Part#: |
ATS-02C-28-C1-R0 |
| Price: | $ 6.22 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-28-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.59818 |
| 30 +: | $ 5.28738 |
| 50 +: | $ 4.97624 |
| 100 +: | $ 4.66528 |
| 250 +: | $ 4.35426 |
| 500 +: | $ 4.04324 |
| 1000 +: | $ 3.96549 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become an increasingly important aspect of modern electronic systems, and Heat Sinks have become one of the most widely used thermal solutions in the industry. The ATS-02C-28-C1-R0 is a cost-effective and versatile heat sink system designed to meet the diverse needs of many different applications. In this article, we will discuss the application field and working principle of the ATS-02C-28-C1-R0. ApplicationsThe ATS-02C-28-C1-R0 is designed for use in many different electronic systems, including consumer electronics, automotive, and industrial applications. Its thin design, corrosion-resistant aluminum construction, and simple installation make it an ideal thermal solution for a variety of thermal management needs. It is suitable for applications such as amplifiers, LEDs, CPUs, motherboards, and other compact electronics. The heat sink can also be easily installed in any position, enabling it to be used in a variety of configurations. Working PrincipleThe ATS-02C-28-C1-R0 is a simple, passive thermal solution that works by transferring heat away from the component or device. Heat is transferred from the device via the heat sink to the atmosphere. The heat sink is designed to maximize the efficiency of heat transfer by increasing the surface area in contact with the air, thus allowing more efficient heat transfer. The design also includes fins which increase the surface area and thus allow more efficient heat transfer. The construction of the heat sink is also designed to allow for optimal heat dissipation. The aluminum construction is corrosion resistant and increases the effectiveness of the heat sink by increasing its conductivity. Additionally, the use of vents and thermal pads can further enhance the heat transfer efficiency of the heat sink. ConclusionThe ATS-02C-28-C1-R0 is a versatile and cost-effective thermal solution designed for use in many different applications. Its simple installation, thin design, corrosion-resistant aluminum construction, and efficient heat transfer technology make the ATS-02C-28-C1-R0 an ideal choice for a wide variety of thermal management needs. |
The specific data is subject to PDF, and the above content is for reference