ATS-02C-32-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02C-32-C1-R0-ND

Manufacturer Part#:

ATS-02C-32-C1-R0

Price: $ 5.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X11.43MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02C-32-C1-R0 datasheetATS-02C-32-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.71933
30 +: $ 4.45704
50 +: $ 4.19492
100 +: $ 3.93271
250 +: $ 3.67053
500 +: $ 3.40835
1000 +: $ 3.34281
Stock 1000Can Ship Immediately
$ 5.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is becoming increasingly important as a way to regulate and spread heat. Among the various tools available to do this, heat sinks are an ideal solution. They are specifically designed to dissipate heat more efficiently than traditional air cooling and fans. One of the most popular heat sinks is the ATS-02C-32-C1-R0. This heat sink is a highly efficient heat-dissipating device that is well-suited for a wide range of applications.

The ATS-02C-32-C1-R0 is an aluminum plate finheat sink. It has two sizes of 32 millimeters and one size of 14 millimeters. The minimum cooling surface is 2.27 square centimeters and the overall weight is 25.3 grams. The heat sink uses a thermal gradient thermoelectric module which enables the chip to dissipate more heat than traditional air cooling and fans. This module allows the heat sink to deliver outstanding performance in a compact size.

The ATS-02C-32-C1-R0 has several handy features that make it an ideal choice for many applications. It is designed to resist the formation of condensation, which can occur when a system is too cool for the ambient temperature. It also has a high thermal conductivity, which helps to dissipate the heat quicker. Additionally, it is designed to reduce the risk of thermal shock and can handle a wide range of temperatures from -30 degrees Celsius to +150 degrees Celsius.

The ATS-02C-32-C1-R0 is also a highly reliable device. It has a long life expectancy, with a mean time to failure of 10,000 hours. This ensures that it is capable of handling harsh environments without failure. The ATS-02C-32-C1-R0 is also CE and RoHS compliant. This means that it meets the environmental and safety standards required by many industries.

The ATS-02C-32-C1-R0 is suitable for a wide range of applications. It is typically used in medical, industrial, and consumer electronics. It can also be used in automotive and aerospace applications. The ATS-02C-32-C1-R0 is well-suited for both high-end and low-end electronics.

In addition to the ATS-02C-32-C1-R0\'s design, its working principle is also essential for proper thermal management. The heat sink works by dissipating heat to the surrounding air. As the air surrounding the heat sink is cooler than the integrated circuit, the heat is drawn away from the circuit and released to the atmosphere. This process helps to keep the integrated circuit cool and prevents overheating.

In conclusion, the ATS-02C-32-C1-R0 is an efficient, reliable, and high-performing heat sink that is suitable for a wide range of applications. Its thermal gradient thermoelectric module allows it to dissipate heat more efficiently than traditional air cooling and fans. Its design also helps to reduce the risk of thermal shock and its working principle helps to keep integrated circuits cool. All in all, the ATS-02C-32-C1-R0 is a great choice for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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