| Allicdata Part #: | ATS-02C-41-C2-R0-ND |
| Manufacturer Part#: |
ATS-02C-41-C2-R0 |
| Price: | $ 6.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-41-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.16518 |
| 30 +: | $ 5.82267 |
| 50 +: | $ 5.48012 |
| 100 +: | $ 5.13759 |
| 250 +: | $ 4.79508 |
| 500 +: | $ 4.45257 |
| 1000 +: | $ 4.36695 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of most electronic systems and devices, as well as many industrial processes. Key to a successful thermal management system is the ability to dissipate heat at a sufficiently high rate. And for that purpose, heat sinks are used.
Among the many different types of heat sinks available, the ATS-02C-41-C2-R0 thermal - heat sink stands out for its superior performance and long-term reliability. Specifically designed to provide consistent heat dissipation for both suitable and non-suitable environments, the ATS-02C-41-C2-R0 features a large surface area, low profile design, and low thermal resistance.
The ATS-02C-41-C2-R0 is designed for a wide variety of applications. It is perfect for both active and passive cooling applications, as well as for use in embedded systems, telecommunications equipment, and high wattage LED lighting systems. Its large surface area and low profile design make it an ideal solution for applications in tight spaces, while its low thermal resistance ensures effective dissipation of heat even in challenging environments.
The working principle of the ATS-02C-41-C2-R0 heat sink is simple but effective. The heat generated from the component or device is transferred to the heat sink, which then dissipates the heat into the surrounding air. The design of the heat sink features a high surface area-to-area ratio, which allows for increased heat transfer between the component/device and the heat sink structure. The heat sink also features a unique fin pattern that maximizes the amount of airflow across its surface area, resulting in an improved thermal performance.
In addition, the ATS-02C-41-C2-R0 also utilizes a thermally conductive aluminium base material with a low thermal resistance chip design and a convex form fit that ensures a secure fit. This combination of design features enables the ATS-02C-41-C2-R0 to provide excellent thermal resistance figures, allowing for the maximum heat dissipation.
The advantages of the ATS-02C-41-C2-R0 thermal - heat sink are numerous. Its low profile design allows for the heat sink to be installed in almost any device or system, and the large surface area ensures excellent heat transfer and dissipation. The convex form fit further ensures a secure fit, while the low thermal resistance chip design and large fin pattern maximize the amount of airflow and heat dissipation. With its superior performance and long-term reliability, the ATS-02C-41-C2-R0 can provide a reliable and cost-effective solution for applications that require effective and efficient thermal management.
The specific data is subject to PDF, and the above content is for reference