| Allicdata Part #: | ATS-02C-55-C1-R0-ND |
| Manufacturer Part#: |
ATS-02C-55-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-55-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of any electronic system. While most electronic components require heat dissipation, the optimal design for any system depends on the thermal characteristics of each individual component. The ATS-02C-55-C1-R0 is a thermal - heat sink designed to regulate the operating temperature of electronic components, while also optimizing power dissipation.
The ATS-02C-55-C1-R0 is designed to maintain optimal operating temperatures for a variety of applications in the commercial electronic market. The heat sink is made from high-performance materials that allow it to effectively dissipate heat while maintaining a compact form factor. The heat sink also features a thick base and fins to maximize heat dissipation efficiency.
The ATS-02C-55-C1-R0 is designed to perform in high-power applications where component temperatures can exceed the designed operating temperature of the device. The heat sink is designed with a variety of thermal characteristics and features that enable it to meet the thermal requirements of the application without raising other thermal design parameters. The heat sink also features an efficient design that allows it to dissipate the heat of the device while lowering overall power dissipation.
The ATS-02C-55-C1-R0 works by dissipating the heat generated by the device into the surrounding environment. The heat sink consists of several components including a base plate, fins, a heat spreader, and fan. The base plate is the primary component in the heat sink and serves as the primary point of heat transfer between the device and the environment. The base plate is composed of a high-conductive material such as copper or aluminum and is designed to effectively dissipate the heat generated by the device.
The fins are connected to the base plate and are designed to allow air to flow around the heat sink. The fins are designed to direct the air flow across the surface of the plate and to dissipate the heat into the surrounding environment. The heat spreader is used to evenly distribute the temperature over the entire surface area of the device, while the fan is used to ensure that the air flow is properly directed to the plate and to dissipate the heat.
The ATS-02C-55-C1-R0 is designed for use in a variety of electronic applications. These applications range from medical and industrial applications, to consumer electronics and computers. The heat sink is designed to be used in these applications and is designed to meet the thermal requirements of each application without raising other thermal design parameters.
The ATS-02C-55-C1-R0 is an effective heat sink designed to provide optimal thermal management in temperature-sensitive applications. The heat sink is designed with high-performance materials that allow it to effectively dissipate heat while maintaining a compact form factor. The heat sink is designed to maintain optimal operating temperatures while optimizing power dissipation. The ATS-02C-55-C1-R0 is an effective thermal solution for any electronic system.
The specific data is subject to PDF, and the above content is for reference