ATS-02C-57-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.13°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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The term ‘heatsink’ is commonly used to refer to a device that helps to dissipate the heat generated by electrical components. In the electronics world, this is particularly important in order to ensure that the components do not overheat and fail. The ATS-02C-57-C1-R0 is one such heatsink which has been designed for high-power applications where heat management is critical.The ATS-02C-57-C1-R0 is a two-stage finned heatsink, specifically designed for applications requiring high levels of reliability and thermal performance. The heatsink is constructed using a combination of thermal grade aluminum and copper, and is designed with an optimal thermal profile to ensure that the maximum amount of heat generated by the component is dissipated away from the component itself.The heatsink consists of two distinct fin arrays. The first array is designed to spread the heat generated by the component across a larger area, thus increasing the area over which the heat can be dissipated. The second array is designed to maximize the convective airflow over the surface of the heatsink in order to help dissipate the heat even further. The fins are also designed in such a way as to reduce the dead spots which can often occur in regular fin designs.In order to make sure that the ATS-02C-57-C1-R0 heatsink is able to efficiently dissipate heat from the components it is attached to, it has to be mounted correctly. To achieve this, the heatsink has a range of mounting options, including clamps, screws, bolts, and nuts. Once the heatsink has been mounted, it is important to apply a thermal interface material (TIM) between the heatsink and the component. This will ensure that the heat generated by the component is effectively conducted away from the component and dissipated into the ambiance.The thermal performance of the ATS-02C-57-C1-R0 heatsink will depend on the components to which it is attached, as well as the airflow pattern that exists in the enclosure the heatsink is mounted in. However, the design of the heatsink has been optimised for maximum thermal efficiency, and with a correctly designed system, it can provide reliable cooling even in the most demanding environments.Overall, the ATS-02C-57-C1-R0 heatsink is an effective solution for applications requiring reliable and efficient heat management. Its combination of design features and mounting options provide a high degree of flexibility, while its two-stage fin array maximises the surface area for efficient heat dissipation. As such, it is the ideal heatsink for any application where thermal performance is crucial.

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