| Allicdata Part #: | ATS-02C-74-C1-R0-ND |
| Manufacturer Part#: |
ATS-02C-74-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02C-74-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a complex phenomenon that involves the transfer and dissipation of heat away from components in order to keep them from overheating. Heat sinks are a common way to handle thermal management, but there are many different types of heat sinks for various applications. A common heat sink is the ATS-02C-74-C1-R0. This article will discuss the application field and working principle of the ATS-02C-74-C1-R0.
The ATS-02C-74-C1-R0 is a two-piece lead fin heat sink. The base of the unit is made of high thermal conductivity aluminum and is designed to be mounted onto a circuit board. The heat sink is designed to dissipate heat from components in the card. The base of the unit is designed to be mounted onto the printed circuit board and the fin section is connected to the base section by a through-hole. The fin section is made of aluminum and is designed to dissipate heat away from the component.
The ATS-02C-74-C1-R0 has a thermal resistance of 1.70 degrees Celsius per watt and can dissipate a maximum heat load of 60 watts. The unit is designed to be used in confined spaces and has a low profile design that reduces air ventilation requirements. The unit is well suited for applications such as computers, industrial equipment, and consumer electronics.
The working principle behind the ATS-02C-74-C1-R0 is based on the principles of conduction and convection. Heat is transferred from the component to the heat sink via conduction, and then dissipated away from the component by convection. The heat sink is designed to absorb the heat from the components and transfer it away from them. The heat is then dissipated away from the components. This process helps to keep the components from overheating and potentially damaging the circuit board or other components.
The ATS-02C-74-C1-R0 is a powerful and reliable way to handle thermal management. It is suited for many applications and is designed to dissipate the heat away from components in a highly efficient manner. The unit is lightweight and easy to install, making it a great choice for many different applications. The unit is also designed for a variety of operating conditions, making it a great choice for a range of applications.
The specific data is subject to PDF, and the above content is for reference