ATS-02C-75-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02C-75-C1-R0-ND

Manufacturer Part#:

ATS-02C-75-C1-R0

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02C-75-C1-R0 datasheetATS-02C-75-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.92446
30 +: $ 2.84550
50 +: $ 2.68733
100 +: $ 2.52926
250 +: $ 2.37119
500 +: $ 2.29216
1000 +: $ 2.05503
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.95°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal technology in the modern day has led to the development of a host of different solutions to different problems, but the uses are ubiquitous. One such example is the ATS-02C-75-C1-R0 which is a thermal-heat sink and its purpose in application and working principle are explored below.

The ATS-02C-75-C1-R0 is a thermal-heat sink which is designed to provide efficient cooling of electronic components which otherwise would not be able to function properly due to their high operating temperatures. The principle of operation is based on the concept of heat transfer, namely convection, radiation, and conduction.

In a convection process, hot air generated by the component is drawn away from it by a fan, which creates an air pressure drop relative to the component. This decrease in pressure results in the burning of the air which will leave the component as heat. This hot air is then dissipated into the atmosphere where it is not a problem.

Radiation is the form of heat transfer that is seen most often in thermally managed components. It works by transferring heat energy in the form of electromagnetic waves, from one object to another. When a component is generating more heat than it needs to operate, the energy is radiated away to the atmosphere.

The last type of heat transfer, conduction, is the transfer of heat through physical contact. In this process, the heat is transferred directly from the component to the thermal-heat sink. This process is highly effective in cooling the component as the heat energy is stored in the heat sink, away from the component. This process allows the component to perform at optimal levels without having to worry about heat build-up.

The ATS-02C-75-C1-R0 thermal-heat sink is designed in a way that maximizes the effect of all three principles, as it incorporates both a fan and heat conductors to reduce the temperature of the working components. It also has a structure which promotes an efficiency due to the efficient flow of air that is achieved with the inclusion of the fan.

The ATS-02C-75-C1-R0 has a wide variety of applications, ranging from the cooling of CPUs, GPUs, and other high-heat computers, to providing cooling for other high-end electronics such as LCD screens and factory equipment. It is also possible to use the ATS-02C-75-C1-R0 in combination with other heat sinks to achieve a more efficient cooling system.

Overall, the ATS-02C-75-C1-R0 thermal-heat sink is a highly effective device for providing efficient cooling to electronic components that require it. The combination of convection, radiation, and conduction provide a highly effective cooling system that is sure to keep components operating at optimal temperatures. This device is designed for ease of use and has a wide range of applications, making it a valuable asset for any established electronics firm.

The specific data is subject to PDF, and the above content is for reference

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