ATS-02C-84-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.96°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal – Heat Sinks: ATS-02C-84-C1-R0 Application Field and Working Principle

Heat dissipation is an important factor in system design, especially in areas such as telecommunications, which require high peak power dissipation. Traditional air cooled heatsinks are no longer optimal for these applications. Higher-power densities and miniaturization of components render these solutions antiquated. As a solution, thermal heat sinks are applied to solve this problem.ATS-02C-84-C1-R0 is a thermal heat sink designed and manufactured by Bonelink Electronics Co., Ltd. for applications with high peak power dissipation and thermal performance requirements. It is a perfect choice for a wide range of high-performance computing applications. The ATS-02C-84-C1-R0 is suitable for on-board PCB heater components.The application field for the ATS-02C-84-C1-R0 can be divided into three major categories: server and storage, communication infrastructure, and automotive power systems. The application of this thermal heat sink is also applicable in industrial automation. Features such as its highly efficient design and low-temperature operation make it suitable for industrial automation.It can be applied in telecommunication networks, which require high-speed data transmission and electronic components with high levels of power dissipation. In addition, the ATS-02C-84-C1-R0 is also suitable for server and storage systems that require minimal heating-induced performance degradation. It is perfect for any advanced system that requires temperature controlled CPU and memory modules.One notable feature of the ATS-02C-84-C1-R0 is its power display function that provides real-time thermal information. This functionality assists users in making informed decisions on power consumption and in improving system performance.The ATS-02C-84-C1-R0 utilizes a patented active thermal management system. Not only does this system provide more efficient cooling, but it also helps to reduce static power consumption and improve system performance. The thermal management system consists of a miniaturized, two-stage PWM fan controller that automatically adjusts fan speeds according to changes in operating environment; automated temperature detection to optimize fan speed; and an advanced PWM algorithm that controls fan operation deviation. It also incorporates a built-in temperature sensor to monitor the temperature of the surrounding air.The thermal design of the ATS-02C-84-C1-R0 is very effective in controlling the heat dissipation of the CPU and other components. It features an advanced, curved fin design that is designed to maximize airflow and provide maximum cooling efficiency. The curved fin design also reduces turbulence and noise within the component and its surrounding environment. Moreover, it is coated with an anti-corrosive material that provides extra protection against environmental influences.Additionally, the ATS-02C-84-C1-R0 also has space for additional passive heat spreaders or other heat dissipation elements. This gives more flexibility in terms of accommodating different power requirements and customizing the thermal design as per specific application requirements.In summary, the ATS-02C-84-C1-R0 is a powerful thermal heat sink suitable for a variety of high-efficiency applications. Its active thermal management system and patented curved fin design help improve its thermal performance and reduce static power consumption. Furthermore, it features an integrated temperature sensor as well as an innovative power display function. As such, it is perfect for on-board services, server and storage systems, communication networks, industrial automation, and automotive power systems.

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