ATS-02D-01-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	22.05°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:ATS-02D-01-C3-R0 is a heat sink device designed for use in thermal processes. It is a passive device used to regulate and dissipate heat away from a source, such as an electronic component, and is designed to improve the efficiency of the temperature control on the equipment. Heat sinks are commonly used to reduce operating temperatures in temperature-sensitive applications, such as electronics and computer components.Design:The ATS-02D-01-C3-R0 heat sink is made from aluminum and designed to effectively absorb, disperse, and dissipate large amounts of heat in a small form. The heat sink is designed to be lightweight, yet durable, and is able to withstand thermal stress. The device features a cross-flow design, allowing for a greater amount of air to move more quickly over the heat generated components. The design of the heat sink also includes heat fin technology, which provides greater surface area for heat transfer, and an overall higher performance.Application Field:The ATS-02D-01-C3-R0 heat sink is suitable for use in a wide range of applications, including electronics, computers, and other temperature sensitive applications. The device can be used to control the temperature of specialized electronic components, such as processors, graphics cards, RAM, and hard disk drives. It can also be used in temperature critical applications, such as high performance computing, and gaming.Working Principle:The ATS-02D-01-C3-R0 heat sink works by dissipating the heat generated by electronic components through its highly efficient thermal design, and ultimately transferring the heat away from the source. The device works by transferring heat through a cross-flow design, which allows for a greater amount of air to be moved quickly across the heat source. The heat fins provide a greater surface area for heat transfer, ensuring maximum performance and a better cooling potential. Additionally, the device utilizes an aluminium alloy which is lightweight, durable, and able to withstand higher temperatures.Conclusion:The ATS-02D-01-C3-R0 heat sink is an ideal solution for managing heat in many temperature-sensitive applications. Its lightweight design and high performance make it an ideal choice for those looking to improve the efficiency of their temperature control system. The device is able to dissipate heat quickly, while providing a greater surface area for heat transfer, helping keep temperatures under control, while improving the overall performance of the system.

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