ATS-02D-10-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS4828-ND

Manufacturer Part#:

ATS-02D-10-C2-R0

Price: $ 4.19
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02D-10-C2-R0 datasheetATS-02D-10-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.80520
10 +: $ 3.70125
25 +: $ 3.49574
50 +: $ 3.29011
100 +: $ 3.08448
250 +: $ 2.87885
500 +: $ 2.67322
1000 +: $ 2.62181
Stock 1000Can Ship Immediately
$ 4.19
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management heat sinks are essential components of electronic assemblies. Heat sinks are designed to transfer heat away from hot electronic components, such as CPUs, GPUs, ram, and disc drives, allowing them to function at their peak performance. They are a vital component in both active and passive cooling systems, helping maintain the optimal working temperature for the electronic components inside the system.

ATS-02D-10-C2-R0 is a type of heat sink specifically designed for high thermal applications. It is made from high quality aluminum materials for better cooling performance. Its0.02mm pitch fins provide maximum surface area and heat dissipation. The heat sink also features a fan-free system with a protected housing and has a slim design with a height of only 16mm.

The working principle behind the ATS-02D-10-C2-R0 is simple but highly efficient. Heat generated by the electronic components is absorbed by the heat sink and then dissipated into its fins. The fins are designed to increase the overall surface area and allow the heat to dissipate quicker. The fan inside the heat sink further increases the cooling capacity by creating a cooling airflow around the entire heat sink. As the air passes through the fins, the heat is drawn away from the electronic component and absorbed into the heat sink.

The ATS-02D-10-C2-R0 is mainly used in high power applications such as telecom, industrial, and medical industries where high performance cooling is required. It is also useful in applications such as servers, workstations, and network switches. The heat sink can also be used in a range of high current, industrial control, and embedded systems. Its low profile enables it to be used in a variety of equipment with limited space.

In summary, ATS-02D-10-C2-R0 is a highly efficient heat sink designed for high thermal applications. It is made from high quality aluminum, has a slim design for easy installation, and features a fan-free system for maximum cooling efficiency. It is mainly used in high power applications such as telecom, industrial, and medical industries where high performance cooling is essential. Its low profile enables it to be used in a range of equipment with limited space.

The specific data is subject to PDF, and the above content is for reference

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