| Allicdata Part #: | ATS-02D-11-C3-R0-ND |
| Manufacturer Part#: |
ATS-02D-11-C3-R0 |
| Price: | $ 3.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-11-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.48138 |
| 30 +: | $ 3.28818 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks play an important role in the prevention of overheating, as well as the more efficient usage of computers and general electronic devices. In order to make sure these heat sinks remain in tip-top condition, it is important to make sure they have the right application field and working principle. The ATS-02D-11-C3-R0 is a great example of a thermal-heat sink designed for this purpose.
The ATS-02D-11-C3-R0 application field includes cooling an heat dissipating mechanisms such as cabins, small electronics, and very small communication units. It is also used in particular fields of CPU cooling, such as cooling in personal computers, as well as fanless applications. Its main purpose is to safeguard these devices from the damages of the overheat, which is why this model is also suitable for the monitoring of low-temperature areas.
The working principle of the ATS-02D-11-C3-R0 is based on a simple concept called conduction, or the transfer of heat energy from one location to another. The thermal-heat sink works by receiving the heat energy on one side and transforming it into the desired amount of air in which to exhaust the device. As the exhaust air comes up from the thermal-heat sink, it allows for a cooler environment around the device. This in turn helps the device reach its optimized temperature, and maintain a steady state for performance.
The design and construction of the ATS-02D-11-C3-R0 is also extremely important, as it helps shape the product’s ability to dissipate the heat energy efficiently. It features an efficient LED lighting system that can provide visual feedback in low light conditions, ensuring that the device won’t overheat. Additionally, the structure of the thermal-heat sink is designed to allow for a wide range of surface temperatures, which helps to avoid the wasted energy that could occur due to thermal overload.
In terms of the materials used to construct the ATS-02D-11-C3-R0, high-quality, lightweight aluminum is the main choice. This metal is known for its heat transfer properties, and its ability to dissipate heat quickly and safely. Secondly, the cooling agents within the thermal-heat sink are designed to work in conjunction with the aluminum, and to help dissipate and dissipate heat quickly, as well as cooling the device in the process.
In conclusion, the ATS-02D-11-C3-R0 is an exceptional thermal-heat sink and a great example of a product designed for use in fields such as CPU cooling and fanless applications. Its design has been put together to take advantage of the efficient LED lighting system, allowing for safe and steady temperature control. Additionally, its lightweight and efficient aluminum construction ensures that it can quickly dissipate heat in an efficient manner, while also cooling the device in the process. This makes the ATS-02D-11-C3-R0 an ideal choice for keeping electronic devices running in optimal condition, and safe from any potential overheating problems.
The specific data is subject to PDF, and the above content is for reference