ATS-02D-146-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02D-146-C1-R0-ND

Manufacturer Part#:

ATS-02D-146-C1-R0

Price: $ 3.70
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02D-146-C1-R0 datasheetATS-02D-146-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.36420
30 +: $ 3.27348
50 +: $ 3.09154
100 +: $ 2.90972
250 +: $ 2.72785
500 +: $ 2.63691
1000 +: $ 2.36412
Stock 1000Can Ship Immediately
$ 3.7
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.98°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are a vital component in many electronics and engineering systems. In the electronics industry, the purpose of a heat sink is to dissipate heat generated from electrical components. Heat can be a major issue in electronics, causing parts to fail when subjected to too high of a temperature. Heat sinks are essential to controlling and dissipating this heat so that the parts don’t fail. One such heat sink is the ATS-02D-146-C1-R0.

The ATS-02D-146-C1-R0 is a type of thermal heat sink, which is designed to dissipate heat that is generated by electrical components. It is made of aluminum, with a larger surface area than typical heat sinks, to allow for efficient heat conduction from the components to the heat sink. The ATS-02D-146-C1-R0 also includes a built-in fan which allows for air-cooling of the components, in addition to the heat dissipation process.

The main application field of the ATS-02D-146-C1-R0 heat sink is in electronics, specifically in devices that generate a significant amount of heat, such as computers, servers, control systems, and other embedded systems. The heat sink is designed to be used in conjunction with high-powered devices, such as processors, GPUs, CPUs, and others. This helps keep the components cool, extend their lifespan, and reduce the chance of failure from heat.

The ATS-02D-146-C1-R0 heat sink works by drawing heat away from components and transferring it into the aluminum body of the heat sink. The aluminum body then dissipates the heat to the surrounding air, aided by the fan. The large surface area of the heat sink allows for efficient heat transfer, while the fan helps to reduce the temperature even further.

In addition to its application in electronics, the ATS-02D-146-C1-R0 can also be used in automotive and industrial applications. It is designed to be able to dissipate heat from motors, industrial sensors, and other high-powered equipment. The thermal heat sink can also be used in HVAC systems or as part of a larger cooling system.

The ATS-02D-146-C1-R0 is an effective and efficient way to dissipate heat from electrical components. Its large surface area and built-in fan allow for efficient and effective cooling without compromising the performance of the component. The heat sink is suitable for use in a wide range of applications, from electronics to automotive and industrial equipment. It is an essential tool for keeping electrical components from overheating and potentially failing.

The specific data is subject to PDF, and the above content is for reference

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