| Allicdata Part #: | ATS-02D-150-C1-R0-ND |
| Manufacturer Part#: |
ATS-02D-150-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-150-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are components used to transfer heat away from computer components such as processors, memory modules, and video cards. ATS-02D-150-C1-R0 is one such product that is designed for the purpose of transferring heat away from such components.
The ATS-02D-150-C1-R0 cooling device is a heat sink dissipating thermal resistance product that helps minimize over-heating of components by dissipating and transferring heat to an external source. It utilizes forced airflow as its fan to draw the ambient air across the thermal resistance for cooling while still remaining quiet and having low power consumption.
Application Field and Working Principle
The ATS-02D-150-C1-R0 device is designed to be used in applications such as general purpose electronics, as well as in computer systems. This heat sink device is constructed with an aluminum alloy, allowing for better heat transfer; as well as using a combination of aluminum fins and copper heat pipes to increase the thermal resistance and cooling surface area. The fins are designed to be stacked up in a folded layout to maximize cooling effect.
This device is designed for quiet operation, with a maximum noise level of 29.7 dBa, and consumption of 60 W max inside the machine. This makes it ideal for applications where noise is a serious concern, making it suitable for most computer systems.
The working principle of ATS-02D-150-C1-R0 revolves around a fan system that creates airflow across the fins of the heat sink, drawing the ambient air with it. This forces the warm air away from the component, drawing it over the fins of the heat sink where it is cooled by the metal and disperses into the surrounding area. This process is the key to keeping the components cool in the system.
In addition to its cooling capabilities, this device also offers protection from dust and moisture ingress, which makes it suitable for use in outdoor applications as well. It can also be used in humid and high temperature conditions, making it ideal for applications where these factors play an important role.
The ATS-02D-150-C1-R0 device is designed with an aluminum alloy back plate to improve thermal transfer and durability, and is also designed to reduce the overall size of the device. This allows it to fit into tight spaces, and is very easy to install in software-based cooling solutions. It also comes with a heat sink bracket for mounting and a fan option to direct air across the heat sink.
The specific data is subject to PDF, and the above content is for reference