| Allicdata Part #: | ATS-02D-151-C1-R0-ND |
| Manufacturer Part#: |
ATS-02D-151-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-151-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to manage the heat generated by electronic components. The heat that is generated must be dissipated away to ensure the device will not overheat and sustain damage. The heat is dissipated away from the components by either convection or radiation and radiators or heat sinks are often used as thermal management solutions.
The ATS-02D-151-C1-R0 heat sink is a thermal management solution product used in many industrial applications. It is specifically designed to provide maximum heat transfer efficiency and is very well suited for power stages, industrial applications, control panels and test equipment.
The ATS-02D-151-C1-R0 heat sink is made of extruded aluminum and features a full fin design with simple mounting. Its compact design and excellent performance make it an attractive choice for any application where heat must be dissipated. The heat sink is lightweight, and can be easily mounted on a power device or case. It has a maximum fin area of 494 cm2, a maximum wattage of 95 W, and a maximum temperature rating of 95°C.
The two main ways in which the ATS-02D-151-C1-R0 dissipates heat are convection and radiation. When heat is generated by electronic components, it is transferred to the heat sink by convection. The air around the heat sink is heated, causing it to rise and create a cooler air flow. This process causes air to be constantly moving around the heat sink, dissipating the heat away from the device.The second way the ATS-02D-151-C1-R0 dissipates heat is through radiation. This involves the transfer of heat through the radiation of infrared energy, which is absorbed by the heat sink. The heat is then dissipated from the heat sink to the surrounding environment. The fins of the ATS-02D-151-C1-R0 are designed to maximize the surface area of the heat sink, allowing for more efficient radiation.
The ATS-02D-151-C1-R0 heat sink is designed to be both cost-effective and reliable. It is lightweight and compact, making it an ideal solution for many industrial applications. Its full fin design and simple mounting make it easy to install and use. Additionally, its maximum wattage rating and maximum temperature rating offer assurance that the heat sink will be able to handle any projects it is used for.
In summary, the ATS-02D-151-C1-R0 thermal management solution is a reliable, cost-effective option for dissipating heat away from electronic components. Its full fin design and simple mounting make it easy to install and use. It offers a maximum wattage rating and maximum temperature rating, giving users confidence that it will be able to handle any projects that it is used for. The ATS-02D-151-C1-R0 heat sink is a great choice for any application which needs efficient thermal management.
The specific data is subject to PDF, and the above content is for reference