| Allicdata Part #: | ATS4888-ND |
| Manufacturer Part#: |
ATS-02D-154-C2-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-154-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.84930 |
| 10 +: | $ 3.74787 |
| 25 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important concern for many consumer, industrial, and automotive applications. Electronic components become hot when they are operated which is why heat sinks are essential components to consider when selecting thermal management solutions. ATS-02D-154-C2-R0 is a high-performance finned heatsink, designed to maximize the dissipation of heat from electronic components such as chipsets, circuit boards, and other smaller form factor electronic components. This thermal management solution is highly efficient, cost effective, and reliable for numerous applications.
The ATS-02D-154-C2-R0 heatsink has a unique finned design which directs air through the fins of the heatsink, efficiently cooling the component it is attached to. The finned pattern is widely spaced which allows for maximum heat transfer from the component. The heatsink is made from high-grade aluminum which is highly efficient at dissipating heat and is able to withstand extreme temperatures.
The ATS-02D-154-C2-R0 is ideal for a wide range of applications including embedded systems, consumer electronics, industrial automation, automotive applications, medical devices, and more. It is easily mountable using appropriate mounting hardware and allows for quick thermal performance optimization. The heatsink features integrated heat management components such as air baffles and performance optimized fins.
The ATS-02D-154-C2-R0 heatsink works by dissipating heat generated by the component it is attached to. This is achieved by the fins of the heatsink which provide a large surface area for the air passing through them to absorb the heat. As air passes through the fins it takes the heat away from the component before dissipating it into the environment. The process is known as heat exchange and the more surface area on the fins the more heat is absorbed and transferred from the component being cooled.
The ATS-02D-154-C2-R0 is also a great solution for active cooling applications, as it is able to dissipate the heat generated by the component quickly and efficiently. It is also low noise, with the fan being completely silent during operation. This makes it ideal for applications where noise generation is not desirable. The heatsink also features an anodized rectangular base which provides the highest level of heat transfer capabilities.
In conclusion, the ATS-02D-154-C2-R0 is an excellent thermal management solution for a range of applications. It is highly efficient, cost effective, and reliable, and provides a perfect solution for demanding applications such as embedded systems, consumer electronics, industrial automation, medical devices, and more. The heatsink features high-grade aluminum fins and an anodized rectangular base, providing maximum heat transfer capabilities and maximum effectiveness.
The specific data is subject to PDF, and the above content is for reference