ATS-02D-167-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02D-167-C1-R0-ND

Manufacturer Part#:

ATS-02D-167-C1-R0

Price: $ 3.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02D-167-C1-R0 datasheetATS-02D-167-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.82933
30 +: $ 2.75289
50 +: $ 2.60001
100 +: $ 2.44705
250 +: $ 2.29408
500 +: $ 2.21761
1000 +: $ 1.98820
Stock 1000Can Ship Immediately
$ 3.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.03°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are essential in many industries, from automotive and consumer electronics to medical and military applications. For extreme environments, relying on conventional heat sinks is not enough. This is where the ATS-02D-167-C1-R0 thermal heat sink comes into play. The ATS-02D-167-C1-R0 is a revolutionary cooling product that offers a variety of advantages over conventional heat sinks. The ATS-02D-167-C1-R0 is a thermal heat sink with an oversized fin area, a C-shaped fin structure, and a mounting plate which is designed to fit standard air-cooled power electronic modules. This heat sink is manufactured from extruded Aluminum and is anodized for corrosion protection, making it ideal for any application that requires superior thermal performance. The oversized fin area allows for maximum cooling capacity while the fin structure enables it to operate efficiently in turbulent airflow conditions. Furthermore, the ATS-02D-167-C1-R0 is designed with optimized air flow paths to ensure that air passes through the fin structure evenly. The ATS-02D-167-C1-R0 is an excellent choice for high powered applications that require reliable cooling solutions. It can be used in a variety of applications such as Interconnects, Inverters, Motor Drives, Hard Disk Drives, TV/Stereo, and other high-powered components. The ATS-02D-167-C1-R0 offers superior performance by absorbing heat from the component and dispersing it into the ambient air. This is achieved through the use of thermally conductive materials that rapidly disperse heat away from the component and into the surrounding air. The fin structure of the ATS-02D-167-C1-R0 further improves heat dissipation by providing additional surface area which helps to absorb heat from the component and disperse it into the air. The ATS-02D-167-C1-R0 is an effective and reliable thermal management solution that offers superior thermal performance and a range of advantages over traditional heat sinks. Its oversized fin area provides maximum cooling capacity while its fin structure ensures efficient operation in turbulent airflow conditions. Furthermore, its optimized air flow paths ensure that air is evenly distributed over the fin structure for improved heat dissipation. The ATS-02D-167-C1-R0 is an ideal solution for applications that require reliable cooling solutions.

The specific data is subject to PDF, and the above content is for reference

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