| Allicdata Part #: | ATS-02D-179-C1-R0-ND |
| Manufacturer Part#: |
ATS-02D-179-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-179-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are integral components in various forms of electronics technology. In particular, the ATS-02D-179-C1-R0 heat sink is a versatile and reliable component for the necessary cooling operations of various types of integrated circuits and transistors. With its ultra-durable shear-resistant aluminum construction and stainless steel screws, it is capable of effecting maximum heat transfer with minimal exertion.The ATS-02D-179-C1-R0 is designed to dissipate heat on components such as hybrid circuits, LED modules, and DDRs, as well as other common chip components found in many electronic products. Its peak-temperature capability is 110 C and can tolerate up to 1.2 W/cm2 power dissipation. It also has a mounting hole pattern that allows for the use of the same standoffs used for traditional aluminum heat sinks.In terms of its working principle, the ATS-02D-179-C1-R0 contains a heat pipe that allows heat to flow from a heat source to the heat sink. The heat pipe itself is composed of two compartments, one of which is a vacuum. Heat entering the heat pipe is conducted down an outer tube and then carried through a vaporized, heat-conductive liquid located in the vapor chamber. The heat is dissipated through the large, finned aluminum radiations of the heat sink.The combination of the heat dissipating capacity of large aluminum radiations and the vacancy within the heat pipe creates a vacuum heat transfer system, in which heat is quickly transported away from its source. This process provides fast and efficient cooling for computing operations, helping to increase the lifespan of the associated components.The ATS-02D-179-C1-R0 is built for maximum performance and designed to meet the demands of a wide variety of applications. It is the ideal choice for those who require reliable cooling solutions at a reasonable cost. With its performance-driven design, this powerful thermal heat sink is the perfect fit for any scenario where efficient and reliable cooling is paramount.
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