| Allicdata Part #: | ATS-02D-29-C3-R0-ND |
| Manufacturer Part#: |
ATS-02D-29-C3-R0 |
| Price: | $ 7.62 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-29-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.86070 |
| 30 +: | $ 6.45687 |
| 50 +: | $ 6.05329 |
| 100 +: | $ 5.64971 |
| 250 +: | $ 5.24619 |
| 500 +: | $ 5.14530 |
| 1000 +: | $ 5.04441 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal solutions are necessary to protect all kinds of electronics. In the thermal management arena, heat sinks are the most common thermal solution due to their performance, reliability and versatility. ATS-02D-29-C3-R0 is one of these thermal solutions, and is designed for applications such as:
- Industrial control systems
- Telecommunications
- Networking
- Power supply
- Automotive
- Consumer electronics
A heat sink is a passive heat exchanger that transfers heat generated by an electronic device or system into the surrounding environment. The term is typically used to describe a device which is used to cool electronic components. Heat sinks come in various sizes, materials, shapes, and colors so that they can be effectively suitable for any application.
The ATS-02D-29-C3-R0 is a 2D Heat Sink with a 29mm base, and is designed to offer reliable thermal performance with an ultra-low volume. Featuring an all-metal, laser-cut, anodized frame, it is designed for an easy and quick assembly. This heat sink offers a large surface area that efficiently dissipates heat, allowing the device to operate at lower temperatures and reduce power consumption. It is also optimized for better natural convection and is tolerant to overvoltage conditions.
The working principle of a heat sink is simple. Heat from the device is conducted through a heat-conductive material, such as aluminum or copper, and dissipated into the environment. The thermal interface material on the heat sink ensures good thermal contact between the heat sink and the device. This improves the heat transfer efficiency. The size, shape, and design of the heat sink are also important in heat dissipation. A larger heat sink will dissipate more heat, while a smaller one will dissipate less heat.
The ATS-02D-29-C3-R0 is a highly efficient, reliable, and robust thermal solution for a variety of applications. With its large surface area and low profile design, it is an ideal choice for any application requiring high thermal performance in a compact package. It is easy to install and maintain, making it a great choice for designers who need a robust and reliable thermal solution.
The specific data is subject to PDF, and the above content is for reference