| Allicdata Part #: | ATS-02D-36-C1-R0-ND |
| Manufacturer Part#: |
ATS-02D-36-C1-R0 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-36-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.81°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in the electronics industry has become increasingly more integral as components get smaller and their heat output increases. Thermal management solutions such as heat sinks, fans and other cooling accessories can help reduce the heat output from active and passive components such as transistors and integrated circuits. One such product is the ATS-02D-36-C1-R0 heat sink. This article will discuss its application field and working principle in detail.
This particular heat sink model is designed for use with 2N series transistors or other components that require cooling, and its construction includes a large, aluminum-finned heat sink base, along with a fan and several mounting brackets that secure the unit to the host system. The base of the ATS-02D-36-C1-R0 is anodized to improve heat transfer from the component to the heat sink, and the fan and brackets enable efficient active cooling to and from the component.
The application field of the ATS-02D-36-C1-R0 heat sink is primarily within small-scale electronics design. It is ideal for use in low-power, low-noise applications, such as in consumer electronics, automotive electronics, appliances, or any other scenario where the space and cost constraints are tight and the thermal dissipation needs are low. The fan, aluminum-finned base and anodized coating are all designed to improve heat transfer and dissipate it quickly.
The working principle of the heat sink is fairly simple. Heat is generated from the electronics components, and is transferred from the component to the base of the heat sink through conduction. The anodized coating on the base of the heat sink efficiently helps transfer the heat to the fins, which dissipate the heat into the surrounding air by convection. Additionally, the fan helps to remove hot air and draw in cooler air from outside, speeding up the convection process and thus keeping the component cool.
In summary, the ATS-02D-36-C1-R0 aluminum-finned heat sink is a reliable and cost-effective solution for cooling small-scale electronics components. Its application field and working principle offer reliable thermal dissipation without being too complex or costly. With its anodized coating, the heat transfer of the heat sink is improved greatly, and the addition of the fan helps to keep the components running cool and stable.
The specific data is subject to PDF, and the above content is for reference