| Allicdata Part #: | ATS-02D-37-C2-R0-ND |
| Manufacturer Part#: |
ATS-02D-37-C2-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-37-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are vital components in electronic device applications, and the ATS-02D-37-C2-R0 is a classic example of such an application. The ATS-02D-37-C2-R0 is a thermal heat sink that is used to dissipate heat from electronic devices. This heat sink has a specifically designed shape and size that facilitates efficient cooling by using a combination of thermal conduction and convection.
When an electronic component generates excessive heat, the heat sink’s temperature is raised and its surface dissipates heat away from the device. Heat sinks use air or another material to effectively and rapidly transfer heat. Although the material used will depend on the specific application, ATS-02D-37-C2-R0 is typically made from a combination of aluminum alloy and copper base plate.
ATS-02D-37-C2-R0 has a carefully engineered shape and design to maximize its performance. Its fin design and format promotes the movement of air through the heat sink devices and helps to dissipate heat efficiently. The size of the heat sink also facilitates the necessary air circulation, as well as maximizing the surface area available to reduce heat.
Another feature of ATS-02D-37-C2-R0 is its four-core heat pipe design. This design allows the heat sink to rapidly dissipate the heat absorbed from the heated component. Heat pipes absorb the heat from the component, then use an internal fluid to absorb the heat and transfer it through the heat pipe. The heat is then transferred to the heat sink where it is dissipated.
In addition, ATS-02D-37-C2-R0 is designed in such a way that it does not create an electric field on the surface, making it safe to use inside electronic devices. It features two copper wires in the center of the fins which reduce the eddy current losses preventing any electric field build up and providing better conduction of heat from the component. Finally, the heat sink attaches to the component so that it can fully transfer heat away from the device, making it an effective form of heat dissipation.
The ATS-02D-37-C2-R0 thermal heat sink is a useful and effective tool for dissipating heat in electronic device applications. Its unique design enables it to maximize heat transfer away from the component and its size and shape promote efficient heat dissipation. This makes it a reliable and safe solution for a variety of electronic device applications.
The specific data is subject to PDF, and the above content is for reference