ATS-02D-50-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.99°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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A thermal heat sink is an essential component for a variety of applications, ranging from heat generation to dissipating heat. The ATS-02D-50-C1-R0 is a high performance thermally conductive heat sink designed for LEDs and other thermally-sensitive applications. It is capable of dissipating heat efficiently, resulting in improved performance and higher reliability.The ATS-02D-50-C1-R0 is a compact design that fits easily into tight locations. Its lightweight material is designed to be highly durable and resistant to corrosion. Its sleek finish makes it ideal for use in a variety of applications, from automotive and consumer electronics to medical, industrial, and other specialized applications.The ATS-02D-50-C1-R0 uses a combination of air circulation and thermal conduction to increase performance. On its underside, air gaps between unique aluminum fins are designed to allow air to move efficiently, which is effectively drawn in and released, helping to reduce heat buildup and improve performance. Above the fins, the heat sink is designed to draw in air from outside the unit and turn it into hot air, which is circulated away from sensitive electronic components. This air circulation also helps to reduce temperatures, resulting in increased performance, extended equipment life, and improved safety.The ATS-02D-50-C1-R0 is designed to bond seamlessly with the device it is paired with. It uses a thermal compound to create a tight bond between the device and the heat sink, ensuring a secure and reliable connection. The thermal compound is designed to be highly tolerant to vibration and shock, helping to extend the life of the heat sink and protect the components inside.The ATS-02D-50-C1-R0 also helps to reduce thermal runaway. Thermal runaway is when electronic components overheat and begin to generate even more heat, resulting in a dangerous and destructive chain reaction. The ATS-02D-50-C1-R0 is designed to prevent this process, dissipating the heat quickly and reliably to reduce the risk of fire or other serious damage.The ATS-02D-50-C1-R0 is designed to be highly reliable and efficient, thanks to its advanced construction. Its unique, lightweight aluminum fins are designed to quickly transfer heat away from components, allowing for improved performance and reliability. This heat is dissipated quickly and efficiently, reducing the need for external cooling systems.The ATS-02D-50-C1-R0 is perfect for applications that require a lightweight, reliable, and efficient cooling solution. Its advanced construction and design makes it ideal for use in a variety of applications ranging from automotive and consumer electronics to medical and industrial. With its sleek finish and resistance to corrosion, it is a reliable and reliable way to dissipate heat efficiently and quickly.

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