ATS-02D-54-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-02D-54-C3-R0-ND

Manufacturer Part#:

ATS-02D-54-C3-R0

Price: $ 4.07
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02D-54-C3-R0 datasheetATS-02D-54-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.68991
30 +: $ 3.48474
50 +: $ 3.27978
100 +: $ 3.07484
250 +: $ 2.86985
500 +: $ 2.66487
1000 +: $ 2.61362
Stock 1000Can Ship Immediately
$ 4.07
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.19°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-02D-54-C3-R0 Application Field and Working Principle

The ATS-02D-54-C3-R0 is a thermal-based heat sink designed for maximizing heat dissipation from a variety of medium and large-sized processors. Using a combination of aluminum and thermally superior copper alloys, the ATS-02D-54-C3-R0 is capable of operating in an ultra-high efficiency rate, allowing the processor to run cooler than with a standard heat sink.

The application field of the ATS-02D-54-C3-R0 can vary from computers with single processor CPUs to larger servers with multiple processor CPUs, ranging from 40-95 watts. Utilizing a sleek tower design, the ATS-02D-54-C3-R0 is specifically designed for maximum heat dissipation capabilities in either fan or fan free conditions, making it the perfect choice for cooling high-performance computer systems or servers.

The working principle of the ATS-02D-54-C3-R0 relies on transferring heat away from the processor by convection. Heat is transferred from the processor to the heat sink base, which is constructed of anodized copper fins, and the heat is then dissipated through the convection of air around the heat sink fins. This cooling method is known to be one of the most efficient methods of cooling because the air from surrounding environment is naturally circulated over the heat sink fins, resulting in cooler temperatures for the processor.

The ATS-02D-54-C3-R0 is available in one of two mount styles - either as a direct mount or a snap-in mount. The direct mount is ideal for larger systems with multiple processors and allows for easy installation, while the snap-in mount is well-suited for medium and smaller-sized processors where space is limited.

To maximize the cooling capabilities of the ATS-02D-54-C3-R0, it is suggested to install a fan to the heat sink. This will assist in providing additional heat dissipation, while also ensuring the processor does not overheat. It is important to note that fans should be chosen to match the size and design of the heat sink in order to ensure optimal cooling performance.

With its ultra-high efficiency rate and slim design, the ATS-02D-54-C3-R0 is an ideal choice for maximizing heat dissipation from a wide variety of medium and large-sized processors. Utilizing both direct mount and snap-in mount systems, the ATS-02D-54-C3-R0 is capable of providing exceptional cooling as either a fan or fan free system, ensuring the processor operates at optimal temperatures and performance levels.

The specific data is subject to PDF, and the above content is for reference

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