| Allicdata Part #: | ATS-02D-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-02D-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an effective method of spreading heat throughout a system, thus decreasing the overall temperature of critical components. ATS-02D-65-C3-R0 heat sink is designed to do just that - allow air to flow through its fins, thus cooling hot components efficiently. Heat is dissipated by the flat surfaces of the device; this effect is enhanced by the use of aluminum fins that draw heat away from the hot source and disperse it into the air.
The ATS-02D-65-C3-R0 heat sink is comprised of a sturdy die-cast aluminum construction, which provides excellent strength and heat transfer properties. It also includes an integrated fan and air flow management system to optimize performance. The heat sink is designed for low power consumption, which keeps the unit relatively quiet and efficient. The product operates at temperatures ranging from -25 °C to 80 °C, making it ideal for a wide range of applications.
The ATS-02D-65-C3-R0 heat sink is primarily used in electronic systems that require cooling of hot components such as microprocessors, power transistors, and other heat-generating components. By cooling these components, the system is able to operate more efficiently and reduce the risk of premature failure. The device is also widely used in networking and telecommunications equipment, automotive, medical, and other industrial applications.
The heat sink operates on the laws of thermodynamics whereby the heat generated by the components is transferred to the air. The heat is then dissipated by the aluminum fins, which act as an effective heatsink. The integrated fan draws in cold air from outside and forces it over the hot components, thus lowering their temperature. This process, called active cooling, is one of the most efficient methods of heat dissipation available.
The ATS-02D-65-C3-R0 heat sink is designed with an optimized fin layering system that provides an effective solution for cooling hot components. The fin layout of the device is arranged in a spiral, which optimizes the air-flow distribution across the fins, thus providing a more uniform and efficient cooling system. The heat sink also features an advanced thermal control system that can instantly adjust the fan speed according to the temperature of the system, thus providing optimal cooling performance.
In conclusion, the ATS-02D-65-C3-R0 heat sink is an effective solution for cooling hot components in systems that require cooling. Its optimized fin layering system provides an efficient and uniform air-flow distribution, while its advanced thermal control system adjusts the fan speed according to the temperature of the system. The heat sink is affordable and reliable, making it an ideal choice for a wide range of applications including electronics, networking, automotive, medical, and other industrial applications.
The specific data is subject to PDF, and the above content is for reference