| Allicdata Part #: | ATS-02D-70-C1-R0-ND |
| Manufacturer Part#: |
ATS-02D-70-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02D-70-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are one of the most essential components for providing efficient cooling solutions for microprocessors. The ATS-02D-70-C1-R0 is an advanced thermal heat sink designed to absorb and dissipate heat from components connected to a microprocessor. The ATS-02D-70-C1-R0 has a maximum operating temperature of 175°F, allowing for efficient and consistent cooling performance.
The ATS-02D-70-C1-R0 features a heat transfer plate, which is designed to absorb heat from the chip or component it is cooling, and efficiently dissipate the heat throughout the heat sink. This feature is crucial in ensuring the maximum performance of components connected to the microprocessor and protecting them from potential damage. The heat transfer plate is made of a highly durable aluminum alloy, making it tough enough to handle the thermal load and wear and tear of everyday use.
The heat sink also features optimized positioning fins for maximum heat dissipation. The fins are designed to draw in the air from the surrounding environment, which cools the plate and efficiently dissipates heat away from the component or chip. This feature maximizes the efficiency of the heat sink and helps reduce the overall temperature of the area that the sink is cooling.
Furthermore, the ATS-02D-70-C1-R0 is designed to be compatible with all major brands of microprocessors. This ensures that it will deliver maximum performance with minimal installation time and effort. Additionally, the ATS-02D-70-C1-R0 is designed with a two-pin system, making it very easy to install and remove from any standard motherboard.
Given its advanced features and efficient performance, the ATS-02D-70-C1-R0 provides a great solution for providing efficient cooling for microprocessor applications. It is an ideal choice for use in high-performance computing applications that rely on maximum performance from their components. Additionally, it is a great choice for use in industrial, medical, aerospace, and military applications where reliability is a top priority.
The specific data is subject to PDF, and the above content is for reference