ATS-02D-83-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02D-83-C1-R0-ND

Manufacturer Part#:

ATS-02D-83-C1-R0

Price: $ 3.79
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X30MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02D-83-C1-R0 datasheetATS-02D-83-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.44736
30 +: $ 3.35433
50 +: $ 3.16802
100 +: $ 2.98166
250 +: $ 2.79531
500 +: $ 2.70213
1000 +: $ 2.42260
Stock 1000Can Ship Immediately
$ 3.79
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are essential components for a variety of applications. The ATS-02D-83-C1-R0, for example, has been developed as a solution to the demanding thermal control requirements of today\'s electronic applications. In this article, we will discuss the application field and working principle of this heat sink.

The ATS-02D-83-C1-R0 is a high-performance heat sink solution suitable for use in high-temperature applications. The device is designed to efficiently dissipate excess heat from electronic components, extending their lifetime and reducing their power consumption. The design utilizes a combination of both heat-spreaders and heat pipes to maximize heat transfer and minimize energy loss. Additionally, the mounting system is designed for strength, reliability, and easy installation.

The ATS-02D-83-C1-R0 is suitable for a variety of applications, including high-power LED lighting, server racks, industrial automation, telecommunications equipment, data processing and storage, and other high-temperature industrial applications. The device is designed to operate in temperatures up to 150°C and offers superior performance in terms of heat dissipation and system reliability. The highly efficient heat transfer also enables the device to maintain a low-profile design, taking up minimal space.

The working principle of the ATS-02D-83-C1-R0 is based on the phenomenon of natural convection. Natural convection is a form of heat transfer wherein heated air rises resulting in a relatively uniform temperature in the surrounding environment. By leveraging this mechanism, the device is able to effectively direct the heat generated by electronic components away from the components, into the surrounding air. Additionally, the device operates on a fanless design, making it virtually silent.

The thermal design of the ATS-02D-83-C1-R0 further utilizes both active and passive cooling measures. As previously mentioned, the heat spreaders facilitate the efficient dissipation of heat through natural convection. Additionally, the device is outfitted with multiple heat pipes that further promote heat transfer away from the components. Finally, the device also integrates a series of vented fins that promote air circulation to help further reduce operating temperatures.

The combination of these cooling features allows the ATS-02D-83-C1-R0 to provide superior thermal performance as compared to other traditional heat sinks. Furthermore, the flexible mounting system ensures that the device can be easily integrated into a variety of system designs. With its high thermal performance, integrated cooling features, and easy installation, the ATS-02D-83-C1-R0 is an ideal solution for any high-temperature application.

The specific data is subject to PDF, and the above content is for reference

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