ATS-02E-02-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-02E-02-C1-R0 is a thermal – heat sink developed by the company KELONIC. The heat sink is suitable for medium- to high-power applications and is commonly used in the retail and industrial sectors. It has a large surface area and is designed to manage heat dissipation and cooling.The main purpose of the ATS-02E-02-C1-R0 is to regulate and remove the heat generated by components such as integrated circuits, switches, and other devices. This heat sink has been designed with a copper core, highly efficient aluminum fin construction, and an innovative airflow system that provides an optimal heat dissipation. The natural ventilation of the fan creates a convective exchange of air, thereby increasing the efficiency of the cooling process.The ATS-02E-02-C1-R0 uses the thermoelectric cooling principle. This involves the use of a thermoelectric module, which is the thermal-electric device that consists of two temperatures connected to the heat sink and the external environment. This device uses the thermoelectric effect to transfer heat from one side of the device to the other.When the thermoelectric module is connected to the power source, the heat generated by the component is transferred from the heat source side to the sink side. As a result, the ambient temperature on the heat source side will drop and the ambient temperature on the other side will become elevated. This helps to quickly dissipate the heat from the component and lowers its operational temperature.The heat sink is constructed of an aluminum fin construction which provides a large surface area that helps to dissipate heat, and it also quickly and evenly disperses the heat across the entire body. This design provides an effective cooling solution that reduces the amount of heat generated by components in high-power applications.The ATS-02E-02-C1-R0 is designed with a low profile and is lightweight, allowing for easy installation and integration into various systems. It is also durable and resistant to corrosion due to its anodized finish. The heat sink is capable of operating even under extreme conditions of high-temperature, humidity, and vibration and has been designed to meet the most stringent safety and environmental standards.The ATS-02E-02-C1-R0 is effective in applications where efficient cooling and heat management is necessary. This heat sink can be used in a variety of applications such as industrial machinery, automotive, aerospace and military, medical, and telecommunication equipment. Its large surface area and innovative cooling technology make it a great choice for applications requiring optimal thermal performance.

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