Allicdata Part #: | ATS-02E-10-C1-R0-ND |
Manufacturer Part#: |
ATS-02E-10-C1-R0 |
Price: | $ 3.61 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-02E-10-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.28104 |
30 +: | $ 3.19242 |
50 +: | $ 3.01505 |
100 +: | $ 2.83771 |
250 +: | $ 2.66036 |
500 +: | $ 2.57169 |
1000 +: | $ 2.30565 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential in providing reliable performance and long-term reliability of electronic equipment and components. Heat sinks are an important component of any thermal management system. The ATS-02E-10-C1-R0 is a thermal management solution that uses an efficient combination of a heat sink and a fan assembly to provide efficient heat dissipation.
The ATS-02E-10-C1-R0 heat sink is made of extruded aluminum and is designed to provide direct contact with heat sources, such as microprocessors and other hot spots, for efficient heat dissipation. The aluminum is designed to properly dissipate heat away from the source, reducing its temperature in the process. The design also includes air vents to increase air circulation when the fan is used for additional cooling.
The fan assembly, which is also provided with the heat sink, is designed to provide additional cooling to the components being cooled. It is equipped with a flange mount that allows for easy installation directly to the components being cooled. The fan assembly also has a fan speed control feature, which allows for the fan speed to be adjusted depending on the level of cooling needed. This allows for more precise and efficient cooling of the components.
The heat sink and fan assembly work together to provide efficient thermal management performance. The heat sink dissipates heat away from the components while the fan assembly provides additional cooling by circulating air across the heat sink. This combination of cooling and air circulation provides a reliable and efficient thermal management solution.
The ATS-02E-10-C1-R0 heat sink and fan assembly can be used for a variety of applications that require efficient thermal management. It is suitable for use in data centers, computing systems, telecommunications systems, and industrial equipment, as well as other types of high-reliability applications. Additionally, the heat sink can be used in systems that require cooling for high levels of power density, such as high-end gaming systems and virtual reality headsets.
The ATS-02E-10-C1-R0 is designed for easy installation and reliable performance. It comes with an adjustable clip-on bracket that allows for easy installation on a variety of components. The fan assembly also mounts directly onto the heat sink to provide added security. The fan assembly features a dual ball-bearing construction to ensure reliable operation over extended periods of time.
The ATS-02E-10-C1-R0 thermal management solution is a reliable and efficient solution for achieving effective thermal management. It offers easy installation and effective cooling performance that can help to increase the lifespan of components and systems. Additionally, the adjustable fan speed control feature makes it a great option for applications where precise cooling is necessary. The ATS-02E-10-C1-R0 heat sink and fan assembly provide a dependable and efficient thermal management solution.
The specific data is subject to PDF, and the above content is for reference