ATS-02E-110-C2-R1 Allicdata Electronics
Allicdata Part #:

ATS5038-ND

Manufacturer Part#:

ATS-02E-110-C2-R1

Price: $ 5.59
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X40X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02E-110-C2-R1 datasheetATS-02E-110-C2-R1 Datasheet/PDF
Quantity: 1000
1 +: $ 5.07780
10 +: $ 4.93920
25 +: $ 4.66452
50 +: $ 4.39022
100 +: $ 4.11585
250 +: $ 3.84146
500 +: $ 3.56707
1000 +: $ 3.49848
Stock 1000Can Ship Immediately
$ 5.59
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management solutions are becoming increasingly important for the development of new technologies. From PC components, to electric vehicles, to military and aerospace equipment, efficient thermal management is essential for reliable and long-term operation. One type of thermal management technology gaining considerable attention is the use of heat sinks, such as the ATS-02E-110-C2-R1. This article will explore the application field and working principle of the ATS-02E-110-C2-R1 for thermal management.Heat sinks are mechanical devices used to dissipate heat away from electronics components. They work by increasing the surface area for effective radiation, convection, and conduction to occur. Heat sinks come in many different varieties and are used in a variety of applications, including refrigeration systems, HVAC systems, and computers.
The ATS-02E-110-C2-R1 is an advanced aluminum heat sink designed for high-power and high-temperature applications. It has a black anodized finish, and it is thermally optimized for efficient heat sinking. The heat sink is designed for use in a broad range of thermal management applications, including high-power electronics, thermoelectric coolers, and light-weight heat exchangers.
The ATS-02E-110-C2-R1 is composed of highly efficient heat-dissipating aluminum and features a unique design with eight pin fins to increase the surface area available for optimized heat transfer. The heat-dissipating fins are designed to efficiently absorb large amounts of heat from components, ensuring reliable operation and a long service life. Additionally, the ATS-02E-110-C2-R1 features optimized airflow patterns to maximize efficiency and reliability.
The working principle of the ATS-02E-110-C2-R1 is simple yet effective: it utilizes fins to maximize heat transfer to the surrounding environment. The fins act as radiators, exchanging heat with the environment via conduction and convection. The fins also increase the surface area of the heat sink, allowing for more efficient heat dissipation as compared to a flat surface of the same size. Additionally, the optimized airflow patterns further enhance the heat-sinking capabilities of the ATS-02E-110-C2-R1 by facilitating the flow of air over the fins, which helps cool down the components.
In summary, the ATS-02E-110-C2-R1 is an advanced aluminum heat sink designed for high-power and high-temperature applications. It is composed of highly efficient heat dissipating aluminum and features an optimized design with eight pin fins that maximize heat transfer to the surrounding environment. The fins act as radiators, exchanging heat with the environment via conduction and convection, while the optimized airflow patterns further enhance the heat sinking capabilities of the ATS-02E-110-C2-R1. As a result, it is an ideal solution for a range of thermal management applications, including high-power electronics, thermoelectric coolers, and light-weight heat exchangers.

The specific data is subject to PDF, and the above content is for reference

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