| Allicdata Part #: | ATS-02E-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-02E-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential to the effective functioning of any electronic system. Heat generated within a system must be dissipated efficiently in order to avoid costly system malfunction. Heat sinks are the most commonly used solution to dissipate heat generated within a system. The ATS-02E-117-C1-R0 thermal-heat sink solution is designed to be used in high power density applications in order to efficiently control and dissipate heat generated from within the system.
The ATS-02E-117-C1-R0 heat sink is composed of a finned aluminum extrusion and bonded copper heat spreader. A recessed copper and aluminum thermal interface at the base allows for direct contact with the source of heat for maximum heat transfer. The heat sink also features pin-fin technology to improve air flow across the surface of the fin, further increasing the thermal efficiency. The heat sink alsoprovides protection from corrosion and oxidation and has a low profile design to allow for optimum system integration.
In order for the ATS-02E-117-C1-R0 to effectively control thermal performance, it is important to understand its working principle. The heat sink works through the process of convection thermal management. Heat from the source component is transferred to the heat sink fin through the thermal interface. Heat is then transferred away from the fin surface through the natural convection process, created by the air passing over the fin. This process of natural convection results in a higher level of thermal performance when compared to other cooling solutions such as fans or liquid-based systems.
The thermal-heat sink solution is suitable for a variety of applications ranging from consumer electronics and automotive, to medical and military. It is designed for high power density applications and can be used in a variety of small form factor applications. It is an ideal solution for applications such as power amplifiers, video and graphics boards, semiconductor memory chips, control systems and DVD Players.
In high power applications the use of a heat sink is invaluable. The ATS-02E-117-C1-R0 thermal-heat sink solution is crafted to maximize efficient thermal management while minimizing the footprint of the system. By utilizing the natural convection process and pin-fin technology, the ATS-02E-117-C1-R0 is an efficient solution that can be used to control thermal performance and prevent costly system failure.
The specific data is subject to PDF, and the above content is for reference