| Allicdata Part #: | ATS5065-ND |
| Manufacturer Part#: |
ATS-02E-135-C2-R0 |
| Price: | $ 7.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-135-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.81030 |
| 10 +: | $ 6.43419 |
| 25 +: | $ 6.05581 |
| 50 +: | $ 5.67743 |
| 100 +: | $ 5.29887 |
| 250 +: | $ 4.92040 |
| 500 +: | $ 4.82577 |
| 1000 +: | $ 4.73114 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical element of electronic system design in order to ensure reliable operation, long-term component life, and system efficiency. One of the most important components in thermal management is the heat sink, which works by dispersing excess generated heat, away from the system components that can be affected by it. The ATS-02E-135-C2-R0 heat sink is a popular thermal solution for many electronic applications.
The ATS-02E-135-C2-R0 heat sink is a finned passive aluminum component, designed for easy integration into standard electronic or electrical components. The body of the heat sink is an extruded aluminum plate and consists of two distinct parts: a cantilever base and a peg-in-center fin. The cantilever portion provides increased surface area for improved performance, while the peg-in-center fin helps to evenly distribute the heat generated within the heat sink.
The ATS-02E-135-C2-R0 heat sink has an extremely low thermal resistance, making it well-suited for applications where rapid cooling of heat sources is required. The heat sink can be used with a variety of different cooling methods, including airflows, liquid coolants, and refrigerants. Additionally, the ATS-02E-135-C2-R0 heat sink includes an adjustable fan shrouded fan, which helps to ensure even distribution of cooling air.
The ATS-02E-135-C2-R0 heat sink can be used in a variety of electronic applications, including servers, printers, and medical imaging equipment. In servers, the heat sink is useful for dissipating heat away from the processor, motherboard, and memory chips. In printers, the heat sink is useful for removing heat from an adjacent toner cartridge in order to extend the life of the toner. In medical imaging equipment, such as X-ray and ultrasound machines, the heat sink can be used to efficiently cool the system components.
The working principle of the ATS-02E-135-C2-R0 heat sink is relatively simple. As the heat generated within a system is dissipated, the heat sink absorbs it and transfers it away from the components. This is accomplished through convection. The heat sink consists of multiple aluminum fins, which increases the surface area exposed to the air and allows for more efficient heat exchange. As the air is heated by the heat sink, it rises. This natural convection effect results in a continual flow of cooling air across the fins, calming the heat generated by the component.
The ATS-02E-135-C2-R0 heat sink is a highly effective thermal solution for a variety of electronic applications. It\'s versatile design allows for easy integration into existing systems. The adjustable fan shroud and low thermal resistance ensure that the heat sink operates efficiently at all times, allowing for reliable system performance, extended life, and improved system efficiency.
The specific data is subject to PDF, and the above content is for reference