
Allicdata Part #: | ATS-02E-139-C1-R0-ND |
Manufacturer Part#: |
ATS-02E-139-C1-R0 |
Price: | $ 3.12 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X20MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.82933 |
30 +: | $ 2.75289 |
50 +: | $ 2.60001 |
100 +: | $ 2.44705 |
250 +: | $ 2.29408 |
500 +: | $ 2.21761 |
1000 +: | $ 1.98820 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-02E-139-C1-R0 is a family of thermal-heat sinks used in many applications. It is composed of multiple layers of high quality aluminum alloy and has a unique layout of its fins which diminishes heat flow and provides superior heat transfer. These components offer the highest performance to-volume ratio on the market.
The main application of ATS-02E-139-C1-R0 is the efficient cooling of electronic circuits and components by removing the generated heat from the system. The component can be used in a wide variety of electronic devices such as computers, gaming console peripherals, medical devices, and industrial systems. ATS-02E-139-C1-R0 is specifically designed to be used in regulated environments such as those found in aircraft, military, and naval vessels.
The working principle is based on the law of thermodynamics, which states that heat is transferred from a hot object to a cold object until thermal equilibrium is achieved. As the fins on the ATS-02E-139-C1-R0 heat sink draw heat away from the electronic component, the air surrounding the fins becomes cooler, causing it to absorb additional heat. This cycle of heat transfer allows the ATS-02E-139-C1-R0 to remove the heat generated by the component more efficiently than other types of heatsinks.
The ATS-02E-139-C1-R0 has a range of unique features that make it well suited for its application field. Firstly, it is designed with multiple layers of high performance aluminum alloy. This allows it to effectively dissipate heat away from the component, even when the airflow is reduced. Secondly, its layout of fins provides the highest to-volume ratio among commercial thermal-heat sinks, allowing it to fit into small enclosures and equipment. Thirdly, it has been designed with high-manufacturing standards, and has been tested under extreme conditions for increased reliability and durability.
In summary, the ATS-02E-139-C1-R0 is an excellent choice for thermal management applications. Its advanced design allows it to achieve the highest thermal performance from a compact device while its robust construction makes it well suited for use in harsh environments. This makes ATS-02E-139-C1-R0 an ideal choice for a wide range of thermal management applications in regulated environments.
The specific data is subject to PDF, and the above content is for reference