ATS-02E-140-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS5071-ND

Manufacturer Part#:

ATS-02E-140-C2-R0

Price: $ 3.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02E-140-C2-R0 datasheetATS-02E-140-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.20040
10 +: $ 3.11472
25 +: $ 3.03055
50 +: $ 2.86209
100 +: $ 2.69375
250 +: $ 2.52542
500 +: $ 2.44124
1000 +: $ 2.18870
Stock 1000Can Ship Immediately
$ 3.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.28°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are crucial for efficient use of electricity and reducing power consumption. Heat sinks, in particular, are a common solution for dispersing heat from electrical components. The ATS-02E-140-C2-R0 heat sink is an efficient and reliable solution for heat dissipation from many types of electrical components.

The ATS-02E-140-C2-R0 is composed of several components, including a heat sink base, a heat sink fins, and a fan. The heat sink base is typically made of aluminum alloy and is coated with anti-corrosion material. The fins are made of aluminum and have fins that create a large surface area in order to dissipate the heat generated by the electrical components. The fan helps to facilitate convective heat transfer and cooling.

The ATS-02E-140-C2-R0 heat sink is designed to be used in a variety of applications, including processor and peripherals, semiconductors, and motor control applications. It is capable of dissipating heat efficiently from many different components, and it is able to operate in temperate from -30 to 80 degrees Celsius. It is important to note that the ATS-02E-140-C2-R0 heat sink is not designed to be used with high-power components such as LEDs or power transistors.

The ATS-02E-140-C2-R0 works through a process called forced convection cooling. This works by creating a pressure difference between two sides of the heat sink fins. This pressure difference forces air to move along the fins, carrying away the heat from the electrical components. This process is much more efficient than the natural convection process, resulting in improved heat dissipation performance.

In order for the ATS-02E-140-C2-R0 to function effectively, there are a few parameters that must be considered. The size of the heat sink fins, the type of fan used, the fan speed, and the environment in which the heat sink is used will all affect the performance of the heat sink. As such, the ATS-02E-140-C2-R0 is designed to be used in a variety of applications and environments, and these parameters can be adjusted to meet the specific requirements of the application.

The ATS-02E-140-C2-R0 heat sink is a reliable and effective solution for dispersing heat from electronic components. Its efficient operation and wide range of applications make it an ideal choice for many thermal management tasks. Whether it is used in a processor or peripherals, semiconductor, or motor control applications, the ATS-02E-140-C2-R0 heat sink is an effective solution that can help reduce power consumption and provide a reliable heat dissipation solution.

The specific data is subject to PDF, and the above content is for reference

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