ATS-02E-16-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a key component in many electronic equipment and require both the proper application and understanding of how they work to effectively manage heat. ATS-02E-16-C1-R0 is a type of heat sink which has been designed to take on more demanding thermal applications. In this article, we will explore the application field and working principle of ATS-02E-16-C1-R0 and how it can provide the best cooling solution for your electronics.

The ATS-02E-16-C1-R0 is designed to provide highly efficient cooling for electronic components that generate a large amount of heat. It features an aluminum, die-cast body that effectively dissipates the heat generated from high-powered devices, while its organized fin design maximizes surface area to maximize cooling efficiency. With its oversized Base, ATS-02E-16-C1-R0 is capable of dissipating up to 26 Watts and can handle temperatures reaching up to 150 degrees Celsius. Overall, this thermal solution offers a much better performance than standard aluminum-based heat sinks.

One key application of ATS-02E-16-C1-R0 is in the mobile phone and wireless communication industries, as it can handle the high thermal loads generated by components such as processors. It has also been used in various industrial systems, including those used for data storage, and can be used to effectively cool a wide variety of web servers, disk arrays, storage systems, and other types of IT infrastructure. Additionally, ATS-02E-16-C1-R0 is a great solution for use in LED lighting systems, where heat can quickly build up and become a dangerously high level.

In order to understand how ATS-02E-16-C1-R0 works, it is important to understand the basics of heat transfer. Heat is transferred in three ways: conduction, convection, and radiation. A heat sink works by facilitating conduction, where temperatures are transferred from a hotter surface to a cooler surface. In the case of ATS-02E-16-C1-R0, the aluminum body works to draw in heat from the component, dissipate it to the surrounding air, and move it away from the device. The organized fins on the surface help to maximize surface area, thus allowing more heat transfer to occur.

In order to maximize the cooling efficiency of ATS-02E-16-C1-R0, it is important to ensure that the heat sink is installed correctly. It should be fastened firmly against the surface of the component, making sure that it is uncompressed and the fins are not bent. Additionally, the heat sink should be placed in an area that allows for adequate airflow, such as near a fan. Finally, it is important to ensure that the heat sink is of sufficient size for the device. This will ensure that the thermal load is distributed evenly and the device is able to operate efficiently.

Overall, ATS-02E-16-C1-R0 is a great thermal solution for applications that require reliable and efficient cooling. With its die-cast aluminum body and organized fin design, it is able to transfer more heat away from the component and provide faster thermal cooling performance. its oversized base increases its thermal capacity and can be used to handle higher temperatures. Additionally, its compatibility with a wide variety of electronic applications makes it a versatile thermal solution. Therefore, ATS-02E-16-C1-R0 is the perfect choice for cooling electronics in demanding environments.

The specific data is subject to PDF, and the above content is for reference