| Allicdata Part #: | ATS-02E-160-C3-R0-ND |
| Manufacturer Part#: |
ATS-02E-160-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-160-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a vital element to consider in both product design and electronics cooling. To ensure the durability and function of electronic components, heat sinks are used to dissipate heat away from delicate components. The ATS-02E-160-C3-R0 is a thermally-efficient heat sink that can tackle a range of applications, from cooling computer and telecommunications equipment to circuit boards or power supplies.
In its most basic form, the ATS-02E-160-C3-R0 is composed of an aluminum base with an array of fin spacing. Heat generated by the electronic equipment can transfer through the fin spacing or directly from the base of the heat sink. The aluminum acts as a material with good thermal conductivity to draw away heat away from the device. This heat is dissipated to the surrounding environment with the help of fans or natural convection.
The fin spacing of the ATS-02E-160-C3-R0 is designed to provide maximum cooling efficiency while also providing flexibility of installation. The spacing ranges from 5-25 mm, depending on the application. The design of the ATS-02E-160-C3-R0 also enables a variety of enclosures or mounting structures to fit a variety of installation scenarios.
The thermal management of the ATS-02E-160-C3-R0 has several advantages over traditional heat sinks. The fins of the heat sink feature a precision-drilled center hole for mounting. This feature saves time and allows for easy and secure mounting of the heat sink. The fins also feature an optimized clear anodized surface finish, which enhances the thermal performance of the product. The dents on the heat sink gives it a better thermal radiation efficiency.
The ATS-02E-160-C3-R0 is capable of dissipating up to 25 watts of heat per square centimeter. This makes it an ideal heat sink for a variety of applications, ranging from commercial computing and electronics to telecommunications and other industrial applications. The product is also capable of dissipating heat from applications with both high and low power density requirements.
The heat sink is also designed to perform optimally in a range of temperatures. The ATS-02E-160-C3-R0 is designed to maintain its thermal performance from -55°C to +125°C. This ensures that no matter the environment, the heat sink can dissipate heat generated by the component it is attached to.
The ATS-02E-160-C3-R0 offers an ideal solution for cooling electronics and other components. The thermal performance and versatility of the product make it an excellent choice for a variety of applications. With its easy installation and superior thermal performance, the ATS-02E-160-C3-R0 is an ideal heat sink for thermal management.
The specific data is subject to PDF, and the above content is for reference