ATS-02E-169-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS5102-ND

Manufacturer Part#:

ATS-02E-169-C2-R0

Price: $ 3.76
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02E-169-C2-R0 datasheetATS-02E-169-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.42090
10 +: $ 3.32892
25 +: $ 3.23870
50 +: $ 3.05878
100 +: $ 2.87885
250 +: $ 2.69892
500 +: $ 2.60896
1000 +: $ 2.33906
Stock 1000Can Ship Immediately
$ 3.76
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.71°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Introduction

A heat sink is an essential component in many electronic applications and is used to dissipate and dissipate heat from hot components. In general, a heat sink helps to ensure the components stay at the right temperature in order to ensure proper operation and reduce material damage. ATS-02E-169-C2-R0 is a specific type of heat sink, designed to provide a better thermal dissipation performance and increased longevity for industrial-grade applications. This article focuses on the application field and working principle of the ATS-02E-169-C2-R0.

Application Field

The ATS-02E-169-C2-R0 heat sink is specifically designed for extended applications under constant heat dissipating conditions. Some of the environments and applications that can benefit from an ATS-02E-169-C2-R0 heat sink include:

  • Industrial manufacturing
  • Data centers
  • Telecommunication
  • Medical devices
  • Consumer electronics
  • Military and defense
This heat sink is also suitable for a wide range of power levels from 5 watts up to250 watts.

Construction

The ATS-02E-169-C2-R0 heat sink is made of extruded aluminum. The base and fins of the heat sink are machined to exact specifications for optimum performance. The fins of the heat sink are designed to increase heat transfer from the base to the surrounding atmosphere. The fins are also designed to have an optimal height and spacing for air flow, which helps to ensure efficient heat dissipation.

Working Principle

The ATS-02E-169-C2-R0 heat sink is designed to dissipate heat from hot components quickly and effectively. It works on the principle of convection, which is the transfer of heat between two bodies by the movement of air. The heat generated by the components is transferred to the heat dissipative fins of the heat sink by convection. The fins then dissipate the heat into the atmosphere. The air flow around the fins further increases the efficiency of the heat transfer process.

The ATS-02E-169-C2-R0 heat sink is also specifically designed to resist damage from extreme temperatures. The durable aluminum construction of the heat sink ensures it will not warp or deform even after long periods of exposure to extreme temperatures. This ensures that the heat sink will remain operational for extended periods of time and provide reliable performance.

Conclusion

In summarry, the ATS-02E-169-C2-R0 is a specialized heat sink which is designed to provide an enhanced thermal dissipation performance and increased longevity for industrial-grade applications. It is built with an optimized heat dissipative design and aluminum construction to ensure durability and reliability. The ATS-02E-169-C2-R0 is suitable for a wide range of power levels and can handle extreme temperatures. This makes the ATS-02E-169-C2-R0 an ideal heat sink for many industrial, data center, telecommunication, medical device, consumer electronic, and military and defense applications.

The specific data is subject to PDF, and the above content is for reference

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