ATS-02E-182-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02E-182-C1-R0-ND

Manufacturer Part#:

ATS-02E-182-C1-R0

Price: $ 3.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02E-182-C1-R0 datasheetATS-02E-182-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.23379
30 +: $ 3.14622
50 +: $ 2.97133
100 +: $ 2.79657
250 +: $ 2.62181
500 +: $ 2.53441
1000 +: $ 2.27223
Stock 1000Can Ship Immediately
$ 3.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.48°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sinks are specialized pieces of metal that are used to absorb and dissipate thermal energy from electronic components, acting as an interface between the component and the external environment. Heat sinks are particularly important in high-performance computers, as they help improve system efficiency while providing excellent cooling performance over a wide range of operating temperatures. The ATS-02E-182-C1-R0 is a passive heat sink intended for a variety of electronic applications.

Application Field:

The application fields for the ATS-02E-182-C1-R0 heat sink include industrial and commercial electronics as well as systems used in automotive and aerospace applications. It is designed to provide excellent cooling performance over a wide temperature range, from -60°C to +85°C. The heat sink is designed to be used in conjunction with airflow, though the fins are suitable to be used in a fanless system.

Working Principle

The ATS-02E-182-C1-R0 is designed to work by absorbing thermal energy from an electronic component and transferring it to the metal body of the heat sink. The heat is then dissipated to the external environment through the fins, which provide an increased surface area for heat transfer. Heat sinks also help increase the efficiency of electronic components by allowing them to operate at their optimal temperature. This is especially important for high-performance computers, as it helps to improve system performance while protecting components from overheating.

Conclusion

In conclusion, the ATS-02E-182-C1-R0 is a passive heat sink designed for a wide variety of applications, including industrial and commercial electronics, automotive electronics, and aerospace systems. It helps improve the efficiency of electronic components while providing excellent cooling performance over a wide temperature range.

The specific data is subject to PDF, and the above content is for reference

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