| Allicdata Part #: | ATS-02E-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-02E-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are used for dissipating excess heat generated in electronic components and devices. Heat sinks are used in a variety of applications including LED lighting, power transistors, heat dumps for medical equipment and many more. The ATS-02E-20-C3-R0 heat sink is designed specifically for use with power transistors and other semiconductor components.
ATS-02E-20-C3-R0 Application Field and Working Principle
The ATS-02E-20-C3-R0 heat sink is designed for applications that need a highly-efficient, low-noise dissipative environment. Its construction includes an array of fins that are interconnected with a unique, patented designed closed-loop fin stack to enable efficient air flow, along with a combination of air and water-cooled heat carriers. The unique patented design of the ATS-02E-20-C3-R0 allows it to effectively manage and dissipate temperatures up to 100°C and is capable of dissipating up to 126W of power. It is often used as a means of cooling high-performance transistors operating at frequency such as switching power supplies.
The use of multiple fins allows a large number of air pockets to be created between them, which helps to effectively disperse the heat. Additionally, the fins feature small channels that help to guide airflow over and between them. This combination of increased air flow and efficient thermal dissipation results in a cooler, less noisy environment for the device it is used for.
The ATS-02E-20-C3-R0 is designed to be installed directly onto a device. The device should be centered over the heat sink and secured with screws so that it is firmly attached. A mating surface should be provided on the heat sink for efficient heat transfer. The ATS-02E-20-C3-R0 can also be used with a cooling fan to further reduce power consumption and temperatures should the application require it.
In summary, the ATS-02E-20-C3-R0 is designed to provide a highly efficient and low noise dissipative environment for cooling power transistors and other semiconductor components. Its unique combination of powerful cooling capabilities, low noise levels, and easy installation makes it an ideal choice for cooling high-power electronic devices.
The specific data is subject to PDF, and the above content is for reference