| Allicdata Part #: | ATS-02E-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-02E-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-02E-200-C3-R0 is a thermal management device, typically used in the cooling, dissipating, or transferring of heat. It comes under the category of heat sinks.
Heat sinks are designed to reduce the amount of heat generated by a component or system. This is achieved by providing a large surface area in contact with the air, increasing the radiation and convection of heat away from the component or system. Heat sinks usually have a flat plate, but can also be designed with pillars, fins, or other shapes in order to increase the contact area. Aluminum and copper are the two most common materials used for heat sinks, due to their thermal conductivity and cost-effectiveness.
The ATS-02E-200-C3-R0 is designed for larger components and systems where heat transfer needs to be maximized. It has a robust design, constructed with a rugged aluminum frame and copper base. The fins and channels are designed to maximize the radiating surface area for greater heat transfer efficiency. The ATS-02E-200-C3-R0 is a high performance heat sink that can be used in a variety of applications, such as servers, power supplies, CPU cooling, and LED lighting.
The working principle of the ATS-02E-200-C3-R0 is to use the combination of its two materials - aluminum and copper - to evenly dissipate heat. The aluminum frame acts as a radiative surface, while the copper base acts as a convective heat sink. The fins and channels help to further increase the surface area, thus allowing more heat transfer to take place. The larger number of fins also helps to increase the air flow, allowing more air to come in contact with the fins and channels for more efficient cooling.
In conclusion, the ATS-02E-200-C3-R0 is a highly efficient thermal management device designed to reduce the amount of heat generated by a component or system. Its robust construction and efficient design make it suitable for use in a variety of application fields. Its working principle utilizes the two materials, aluminum and copper, to evenly dissipate heat by providing a large surface area for radiative and convective cooling.
The specific data is subject to PDF, and the above content is for reference