| Allicdata Part #: | ATS-02E-22-C3-R0-ND |
| Manufacturer Part#: |
ATS-02E-22-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-22-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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It is essential to understand the application field and working principle of ATS-02E-22-C3-R0 thermal - heat sinks for electronic cooling and heat dissipation. This product is suitable for a variety of applications where cooling is needed, such as power supplies, computers, communications, industrial control, medical electronics, consumer electronics, and other electronic products.
The ATS-02E-22-C3-R0 thermal - heat sink is a heat-dissipating device that converts thermal energy into electrical energy by absorbing and dissipating heat. It consists of a metal core-finned base and a metal-core finned lid. The base and the lid are connected by screws. Both heat transfer surfaces are made of copper or aluminum with metal fins extruded and cut to enhance the heat dissipation capacity. The fins further increase the cooling performance by increasing the surface area, which can improve the cooling performance by up to 500%.
The base and lid are coated with thermal conductive material that helps to efficiently transfer the heat to the cooling fan located on top of the heat sink. The fan further dissipates the heat into the air. The airflow provided by the fan ensures that heat generated by the components is dissipated quickly and efficiently. The air flow also helps to ensure that the components remain at a stable temperature. Heat generated by the components is quickly and evenly distributed around the heat sink, ensuring that the temperature of all components stay within a safe range.
The ATS-02E-22-C3-R0 thermal - heat sink utilizes a multi-fin design that helps to effectively dissipate heat while minimizing noise. The unique design allows the heat to be dissipated more efficiently compared to the traditional single-heat pipe design. The fins also help to reduce turbulence which can create noise when the heat sink is in operation.
The ATS-02E-22-C3-R0 thermal - heat sink also comes with an easy-to-use mounting system that helps to secure it firmly onto the component. This helps to ensure that the heat sink stays in place and is not dislodged when in operation. The integrated rubber pad, which is present on the bottom of the heat sink helps to absorb vibrations which can be caused by the fan.
In conclusion, the ATS-02E-22-C3-R0 thermal - heat sink is a great choice for cooling and heat dissipation in various electronic applications. The multi-fin design provides excellent heat dissipation capabilities while the mounting system ensures that the heat sink is securely fastened to the component to prevent it from being dislodged. The rubber pad helps to absorb vibrations, which can reduce noise during operation and the fan helps to ensure that the heat generated by the components is quickly and efficiently dissipated.
The specific data is subject to PDF, and the above content is for reference