ATS-02E-24-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-02E-24-C3-R0-ND

Manufacturer Part#:

ATS-02E-24-C3-R0

Price: $ 5.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02E-24-C3-R0 datasheetATS-02E-24-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.85793
30 +: $ 4.58808
50 +: $ 4.31827
100 +: $ 4.04838
250 +: $ 3.77849
500 +: $ 3.50860
1000 +: $ 3.44112
Stock 1000Can Ship Immediately
$ 5.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.43°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-02E-24-C3-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are a type of cooling solution designed to transfer thermallygenerated heat away from sensitive components and systems. They are used in applications where thermal management is considered paramount, such as computers, high-end audio/visual devices and power equipment. The ATS-02E-24-C3-R0 is a high performance heat sink design that combines advanced technologies into one product.

The Application Field

The ATS-02E-24-C3-R0 is designed for use in applications where high temperature performance and maximum durability are required. It is also suitable for automotive, industrial, power, and semiconductor applications. The ATS-02E-24-C3-R0 has been specifically designed to meet the ever-increasing demands of today’s components and systems.

The ATS-02E-24-C3-R0 is perfect for applications that require superior heat dissipation. It is highly durable and designed for long life. The ATS-02E-24-C3-R0 is capable of providing up to 85 W/mK of thermal conductivity.. This enables the ATS-02E-24-C3-R0 to effectively dissipate heat generated from a variety of applications. It is suitable for both applications requiring a high degree of heat dissipation performance and those needing a cost effective solution.

The Working Principle

The ATS-02E-24-C3-R0 utilizes advanced thermodynamics to keep components and systems cool. It uses a combination of advanced technologies to provide superior thermal performance. The heat sink utilizes a combination of conduction and convection to transfer away Thermal energy. It utilizes Thermo-electric Cooling (TEC) to dissipate excess Thermal energy generated by components and systems. TEC works by using a thermally conductive material, such as a thermal compound, to draw the heat away from the source and dissipate it to the ambient environment.

The ATS-02E-24-C3-R0 also utilizes an optimized air venting system. This air venting system creates airflow for the heat sink to effectively dissipate Thermal energy away from the source. The ATS-02E-24-C3-R0 also utilizes a Micro-Arc deposition process. This process uses a special process to create a smooth, uniform coating on the surface of the heat sink. This coating provides superior thermal resistance and a low contact resistance for efficient heat dissipation.

Conclusion

The ATS-02E-24-C3-R0 is an advanced thermal - heat sink design that combines superior cooling technologies and delivers outstanding temperature performance. It is perfect for applications that require superior heat dissipation and maximum durability. The ATS-02E-24-C3-R0 utilizes advanced cooling technologies like Thermoelectric Cooling and Micro-Arc deposition to provide superior thermal performance. This makes it the perfect cooling solution for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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