ATS-02E-28-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.57°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: ATS-02E-28-C1-R0 Application Field and Working Principle

Heat sinks are essential components used in modern electronic thermal management systems. In this article, we will discuss one type of heat sink, ATS-02E-28-C1-R0, and the application field and working principle.

What Is ATS-02E-28-C1-R0 Heat Sink?

ATS-02E-28-C1-R0 is a type of thermal management component used in many electronic systems. It is a component made from anodized aluminum with a unique thermal design. It includes two groves in the base of the unit, which helps distribute heat away from the hot spot. The air fins are designed to increase the surface area and help cool the system. Additionally, ATS-02E-28-C1-R0 provides exceptional thermal performance with a compact size, making it ideal for applications with limited space.

Application Field of ATS-02E-28-C1-R0 Heat Sink

ATS-02E-28-C1-R0 is a versatile thermal management component with a wide range of applications. It is suitable for use in electronics systems such as computers, laptops, servers, communication systems, industrial equipment, and medical equipment. It can also be used in automotive and military systems. As a result, it provides thermal protection for multiple types of devices.

Working Principle of ATS-02E-28-C1-R0 Heat Sink

Heat sinks are designed to dissipate heat away from the applications, passively cool the system components, and prevent thermal overload. ATS-02E-28-C1-R0 works by transferring the heat away from the hot spot and cooling the components more efficiently. You can mount the ATS-02E-28-C1-R0 heat sink onto the system component with a heat conductive material such as thermal paste or thermal pads. The heat absorbent material transfers the heat from the component into the heat sink, which further conducts the heat away and dissipates it into the environment. The ATS-02E-28-C1-R0 is a highly efficient heat sink, which provides superior thermal performance in a limited space. It is made from anodized aluminum, which is corrosion-resistant and can handle temperature up to 150 degrees Celsius. The special design of the groves in the base and air fins in the unit further improves the overall thermal performance and makes it more suitable for applications with minimal space.

Conclusion

ATS-02E-28-C1-R0 is a reliable and highly efficient heat sink component. It is suitable for multiple types of applications, ranging from computers and laptops to industrial and medical equipment. The anodized aluminum construction makes the heat sink corrosion-resistant and can handle temperature up to 150 degrees Celsius. The unique design of the groves in the base and air fins in the unit further enhances the thermal performance. With its compact size and exceptional performance, ATS-02E-28-C1-R0 is the perfect choice for many thermal management applications.

The specific data is subject to PDF, and the above content is for reference