ATS-02E-45-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-02E-45-C3-R0-ND

Manufacturer Part#:

ATS-02E-45-C3-R0

Price: $ 3.44
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02E-45-C3-R0 datasheetATS-02E-45-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.12669
30 +: $ 3.04206
50 +: $ 2.87305
100 +: $ 2.70409
250 +: $ 2.53507
500 +: $ 2.45056
1000 +: $ 2.19705
Stock 1000Can Ship Immediately
$ 3.44
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heatsinks are widely used in the field of electronics, as they are able to dissipate the heat generated by electronic components quickly and efficiently, thereby prolonging the lifespan of the parts, reducing the risk of damage and avoiding overheating. The ATS-02E-45-C3-R0 is a industry-leading thermal heat sink designed to provide high performance cooling and designed to meet the most demanding thermal requirements.

The ATS-02E-45-C3-R0 is a 2-piece aluminum heatsink with a flat base and four round fins radiating outwards from the body. The heatsink is designed to be mounted on a flat surface, and the fins help to maximize the surface area of the heatsink and aid in dispersing the heat. The design also features an open air system, which allows for air flow over the entire surface of the heatsink. This helps to further increase the effectiveness of the heatsink in dissipating heat.

The ATS-02E-45-C3-R0 is built for thermal conductivity, providing efficient thermal transfer between the electronic components and the heat sink. This ensures that the components are kept at a stable temperature and reduce the risk of thermal damage due to overheating. It is also designed to minimize excess noise by dampening air flow within the device, providing a more quiet and automated operation.

The ATS-02E-45-C3-R0 is specifically suited for use in applications involving the cooling of low power LEDs, where it has been proven to provide superior cooling performance, even in small spaces. It can also be used for a variety of applications, such as the cooling of CPUs and GPUs in computer systems, as well as consumer and industrial electronics.

In terms of its working principle, the ATS-02E-45-C3-R0 relies on the transfer of heat away from the component and into the thermal heat sink. Heat is an energy which is drawn away from the component through the process of conduction. By attaching the heatsink to the component, the heat is conducted away from the source and absorbed by the thermal heat sink. The heat sink then disperses the energy into the ambient environment, which is why it is so important to use a good quality heat sink.

The ATS-02E-45-C3-R0 can further assist with the cooling process by circulating the air around the components. This helps to reduce the temperature of the component and reduce the risk of thermal damage. This is achieved through the use of high performance fan blades and direct-flow cooling technology.

Overall, the ATS-02E-45-C3-R0 is a high-performance thermal heat sink which is designed to provide effective cooling for a variety of electronic components. Its working principle makes use of thermal conduction to transfer heat away from the source, while its efficient fan blades and direct-flow cooling technology help to circulate the air and reduce the risk of thermal damage. By combining these two methods, it is able to provide superior cooling performance in even the most demanding of applications.

The specific data is subject to PDF, and the above content is for reference

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