| Allicdata Part #: | ATS-02E-59-C3-R0-ND |
| Manufacturer Part#: |
ATS-02E-59-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-59-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has always been an important component of various ICT solutions, with an ever increasing focus on energy efficiency and energy conservation in the current market. ATS-02E-59-C3-R0 is the solution chosen by many users for its wide application field and robust and reliable performance. By understanding the working principle and applications of the ATS-02E-59-C3-R0 thermal management system, users can identify the right tool to address their thermal needs.
ATS-02E-59-C3-R0 is an Isothermic Heat Sink solution that works by transferring heat from the source to a remote area. The device is composed of two main components: the baseplate (or “heat sink”) and the fan. It uses a fan to draw off the heat accumulated on the baseplate, distributing it to the targeted area or device. This allows for efficient cooling without needing to add additional components.
The ATS-02E-59-C3-R0 is well-suited for use in a variety of thermal management applications. It is particularly useful when dealing with high-heat applications, such as data centers and industrial processes. The heat sink is constructed using an aluminum alloy, which is both lightweight and durable. The design also features a series of strategically placed grids, allowing the system to effectively dissipate heat to the targeted area. Moreover, the fan included in the package is designed to handle high-heat applications, with the ability to quickly and efficiently draw heat away from the baseplate without overloading the system.
In addition to its use in high-heat applications, ATS-02E-59-C3-R0 can also be used in low-heat applications, such as personal computing and gaming systems. As with high-heat applications, the fan in the package is designed to distribute heat away from the baseplate efficiently and quickly, ensuring that the temperature stays within desired parameters. Additionally, the aluminum alloy used in the construction helps dissipate excess heat quickly and evenly, allowing for better performance and longer equipment life.
Aside from its thermal management capabilities, the ATS-02E-59-C3-R0 also features several other worthy benefits. The design of the baseplate ensures optimized air flow, resulting in quieter operation. The unit is also energy-efficient, consuming little power while providing great performance. Finally, ATS-02E-59-C3-R0 comes in a convenient, slim size, making it ideal for use in tight spaces and enclosed areas.
Overall, the ATS-02E-59-C3-R0 Isothermic Heat Sink is an excellent solution for various thermal management needs, offering great performance and energy efficiency. With its optimized air flow design and lightweight construction, it is a great choice for users who want both reliable performance and energy conservation. By understanding how the ATS-02E-59-C3-R0 works, customers can confidently choose the right thermal management tool for their specific needs.
The specific data is subject to PDF, and the above content is for reference