| Allicdata Part #: | ATS-02E-88-C1-R0-ND |
| Manufacturer Part#: |
ATS-02E-88-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-88-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are a type of passive heat dissipating device designed to increase the surface area of a heat exchange so as to dissipate heat more quickly. At the same time, they serve to prevent the overheating of electronic devices. The ATS-02E-88-C1-R0 is a thermal-heat sink that is specifically designed for use in communications systems.
The ATS-02E-88-C1-R0 is an efficient heat dissipation device which is suitable for use in a variety of applications. It is designed for use in a variety of communication systems including satellite communication systems, digital transmission systems, cellular base station systems, and microwave communication systems. Due to its compact and lightweight size, it can also be used in wireless access points, routers and other high-power applications.
The ATS-02E-88-C1-R0 has an advanced thermal performance which reduces the amount of energy wasted in the form of heat. It is designed to take advantage of air flow and air temperature in order to improve the performance of electronic components. It consists of a base plate and a heat dissipation plate that can be mounted on any desired surface. The base plate is made of a highly heat-conductive material and contains embedded chips to provide additional cooling capacity.
The ATS-02E-88-C1-R0 also contains a thermal-management circuit that maintains the temperature inside the heat sink within a preset temperature range. This circuit consists of temperature sensors located on the bottom and on the top of the heat sink which detect the temperature inside the heat sink. The circuit then adjusts the fan speed in order to maintain the internal temperature within a preset range. This allows the ATS-02E-88-C1-R0 to operate at a low power consumption while providing effective cooling.
The ATS-02E-88-C1-R0 also has an advanced heat dissipation technology which helps to minimize wasted heat energy. This technology combines a unique combination of materials and manufacturing techniques which help to maximize heat dissipation. The combination of these materials and techniques allows the device to operate at a low temperature while providing a high-performance cooling solution.
The ATS-02E-88-C1-R0 also contains a heat shield which helps to protect the device from environmental influences. This heat shield is designed to shield the device from environmental threats such as wind, rain, snow, and dust. In addition to this, the device is also designed to protect against electromagnetic interference (EMI) which can cause unwanted noise in a communication system.
Overall, the ATS-02E-88-C1-R0 is a high-performance heat sink that is ideal for use in communications systems. It features an advanced thermal-management circuit, advanced heat dissipation technology, and an advanced heat shield which help to increase the performance of communications systems. It is a reliable and efficient thermal-heat sink that can be used in a variety of applications.
The specific data is subject to PDF, and the above content is for reference