| Allicdata Part #: | ATS-02E-89-C3-R0-ND |
| Manufacturer Part#: |
ATS-02E-89-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02E-89-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Blown technology is the process of using thermal-heat sinks to transfer thermal energy from a processor, graphic card, and other components or assemblies of the ATS-02E-89-C3-R0. This process involves the use of an air heat exchanger, or a cooling fin, combined with a thermal interface material. The method is similar to the traditional forced-air-cooling method, but in place of the fan, the heat is dissipated through convection
The ATS-02E-89-C3-R0 is a thermal-heat sink specifically developed for the harsh environment of routers and repeaters. It is a small-sized, low-profile design that offers superior thermal performance. The sink’s design consists of a thin aluminum baseplate, a broad fin structure, and an embedded heat pipe. This combination of components allows for efficient heat transfer in a confined space
The baseplate of the ATS-02E-89-C3-R0 eliminates the need for any additional fan, and offers excellent thermal conductivity. The fin structure is a network of small channels arranged within the heat sink’s baseplate. The dense array of these tiny channels naturally increase the surface area available for heat dissipation. The heat-pipe technology is embedded into the baseplate, and it further increases the sink’s thermal performance
The working principle of the ATS-02E-89-C3-R0 is deceptively simple. It takes advantage of the thermodynamic concept that heat always moves from hotter areas to cooler ones. The ATS-02E-89-C3-R0 draws heat away from the processor and other components and dissipates it through the heat-pipe into the well-ventilated environment provided by the fin structure. The uniformity by which the thermal energy is distributed throughout the network allows for superior thermal management.
The ATS-02E-89-C3-R0 was specifically designed for routers and repeaters but it also offers efficient cooling for other components that generate heat, like processors and graphics cards. When paired with a proper thermal interface, the thermal-heat sink can maximize the efficiency of the components in direct contact with it. Moreover, its minimal space requirement ensures that form and function can both be met in the most compact systems.
The specific data is subject to PDF, and the above content is for reference