ATS-02F-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-02F-10-C1-R0-ND

Manufacturer Part#:

ATS-02F-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-02F-10-C1-R0 datasheetATS-02F-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are integral components of many electrical and electronic components, designed to keep the temperature below a specific level to ensure efficient performance. The ATS-02F-10-C1-R0 is a heat sink specifically designed to be used in electrical and electronic circuits. It is highly efficient in dissipating undesired heat, thereby preventing the thermal runaway of the components. Moreover, it has an excellent form factor, which makes it easy to incorporate in circuits of various sizes and shapes.

ATS-02F-10-C1-R0 Application Field and Working Principle

The ATS-02F-10-C1-R0 is designed for use in a wide range of electrical and electronic components such as power supplies, batteries, converters, and amplifiers. It is also suitable for use in communications, video, and audio systems. It is a high-performance heat sink that effectively dissipates the heat away from the component, thereby increasing the reliability of the electronic circuit.

The ATS-02F-10-C1-R0 has a robust form factor, which makes it suitable for various shapes and sizes of components. It has a slim profile and is lightweight, allowing for easy integration into compact spaces. The footprint provides for excellent thermal dissipation and is constructed from high-grade aluminum. Additionally, it has thermal pads, which facilitate a better heat transfer from the component to the sink.

The working principle of the ATS-02F-10-C1-R0 is simple. When a component generates heat, the sink extracts the heat from the component, then dissipates it away to the environment. This process allows the component to maintain its operational temperature within acceptable limits. The ATS-02F-10-C1-R0 has a high thermal conductivity, which makes it efficient at dissipating the heat away from the component.

The ATS-02F-10-C1-R0 is easy to install and requires no maintenance or repairs. It is also resistant to environment factors and is compliant with the industry standards. Moreover, the ATS-02F-10-C1-R0 is available in a wide range of sizes, which makes it suitable for virtually any application. Additionally, it is highly reliable and provides long-term performance for the component.

In conclusion, the ATS-02F-10-C1-R0 is an excellent heat sink designed specifically for use with various electrical and electronic components. It has a slim profile and is constructed from high-grade aluminum, allowing for heat dissipation. It is also highly reliable and resistant to environmental factors, making it suitable for many applications. Additionally, it is easy to install and requires no maintenance or repairs.

The specific data is subject to PDF, and the above content is for reference

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