| Allicdata Part #: | ATS5224-ND |
| Manufacturer Part#: |
ATS-02F-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-02F-10-C2-R0 is a thermal-heat sink device designed to transfer heat generated by electronic equipment away from the components and into the atmosphere. This device is often found in a variety of applications, including computers, telecom systems, automotive electronics, appliances and laboratory equipment. As one of the most common types of thermal management, heat sinks enable efficient and reliable operation of electronic circuits by dissipating heat.
In principle, a heat sink works by transferring thermal energy from the components to the atmosphere. Heat generated by components such as processors, voltage regulators, and other ICs is first conducted to the base of the heat sink. From there, the heat is conducted to the fins of the heat sink where some of the heat is radiated into the atmosphere. The remaining heat is then convected away from the fins into the atmosphere. This process is then repeated until the components within the device are cooled to an acceptable temperature. Since heat sinks are typically made from aluminum or copper, they are able to dissipate heat more efficiently than other materials.
The ATS-02F-10-C2-R0 is an aluminum heat sink with an anodized black finish and an open-style design. It is designed for use in overhead applications and features a 10mm x 20mm x 50mm profile, making it ideal for smaller electronic devices, such as those found in servers. It includes mounting hardware for easy installation on a variety of devices, including motherboards and DIP packages. The device can also be used with a fan to increase cooling performance. It is an ideal choice for applications where efficient thermal management is necessary but space is at a premium.
The ATS-02F-10-C2-R0 is an effective solution for a wide range of thermal management needs. The open style design increases surface area to maximize thermal performance while the anodized black finish helps to reduce corrosion. Additionally, the device features an efficient heat transfer system that is designed to move heat away from the device as quickly as possible, ensuring optimum performance and reliability. The device is an ideal choice for those applications that require powerful thermal management but are limited by space constraints.
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