
Allicdata Part #: | ATS-02F-111-C1-R1-ND |
Manufacturer Part#: |
ATS-02F-111-C1-R1 |
Price: | $ 5.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 60X40X9.5MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.90455 |
30 +: | $ 4.63176 |
50 +: | $ 4.35935 |
100 +: | $ 4.08694 |
250 +: | $ 3.81448 |
500 +: | $ 3.54201 |
1000 +: | $ 3.47390 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.362" (60.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.374" (9.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 26.72°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal - Heat Sinks with ATS-02F-111-C1-R1
When developing computer systems, the word "cool" is used in the most literal sense. Heat is an enemy that can reduce or reduce the performance and reliability of the system. Therefore, a good cooling solution is necessary to reduce heat and prevent related problems. This is where thermal management systems such as ATS-02F-111-C1-R1 come in. ATS-02F-111-C1-R1 is a thermal - heat sink that helps dissipate heat from a circuit board component or processor.
ATS-02F-111-C1-R1 is a thermally effective heat sink that helps to maintain the low temperature necessary for optimal operating conditions and is able to accommodate the thermal needs of various components. The most common application for ATS-02F-111-C1-R1 is in computers and related peripherals. Though, this heat sink is also suitable for audio applications such as amplifiers, loudspeakers and receivers.
The working principle behind ATS-02F-111-C1-R1 is simple yet effective. It works by dissipation of heat, meaning it absorbs heat from component and dissipates it into the atmosphere. This is done by conduction, meaning the heat is transferred from the source and across the surface area of the heat sink. As more heat is transferred, the temperature of the sink increases, allowing the heat to dissipate more quickly into the atmosphere. To enable this conduction process, the heat sink must have a large surface area, and ATS-02F-111-C1-R1 is thermally engineered with a large external surface area and an extended internal ducting structure to ensure maximum convectiv cooling.
The unique cooling mechanism of this sink ensures that the component temperature will remain stable even when the system is running at full power. This makes ATS-02F-111-C1-R1 an especially suitable choice for high-performance machines with high load constant, such as servers, where a higher concentration of electrical components is present. In addition, the ATS-02F-111-C1-R1 is able to be mounted onto the casings of medium and small sized products, enabling compatibility with a variety of form factors.
The presence of the ATS-02F-111-C1-R1 in computers and related peripherals is very important as it ensures that the system’s components remain within their required operating temperature. The thermally efficient design of this heat sink ensures that maximum heat is dissipated in the shortest time, preventing adverse thermal effects, including component damage, data loss and system shutdown. In addition, the ATS-02F-111-C1-R1 is very lightweight and the mounting system is designed to be easily installed, making it a great choice for large scale installation projects.
ATS-02F-111-C1-R1 is an impressive thermal component and is ideal for a variety of applications. It is able to maintain the temperature of electrical components within the specified range, meaning that the system remains efficient and reliable. The lightweight design and easy mounting system makes it a great choice for installations, meaning it can be used with confidence in a variety of situations. ATS-02F-111-C1-R1 is an example of how modern thermal management systems can be used to keep system running efficiently and reliably.
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