| Allicdata Part #: | ATS5262-ND |
| Manufacturer Part#: |
ATS-02F-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02F-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
A thermal heat sink dissipates heat away from an electronic device or component. It does this by transferring the heat from the device or component to a larger surface or multiple fins, which then dissipates the heat into the air. The heat sink in question, the ATS-02F-134-C2-R0, is manufactured to do just that.
The ATS-02F-134-C2-R0 is a copper-based heat sink with a finger plate design. This heat sink is equipped with fins that are evenly spaced around the device or component it is dissipating heat from. The fins effectively increase the surface area, which allows the heat sink to dissipate a greater amount of heat faster than other designs. The ATS-02F-134-C2-R0 is a 2-piece design that is composed of a base and an extruded fin assembly that are held together with powerful gripping claws.
The ATS-02F-134-C2-R0 is designed to provide superior performance when thermally coupled to an electrically conductive surface. It is also noted that the ATS-02F-134-C2-R0 is compatible with most aluminum-based heat sinks as well as those composed of a high-thermal-conductivity epoxy solder.
The working principle behind the ATS-02F-134-C2-R0 is fairly simple. Heat is generated by the component or device it is attached to, and then transferred to the larger surface area of the ATS-02F-134-C2-R0’s fin assembly. The fins then dissipate the heat out to the ambient air, effectively cooling the device or component.
The ATS-02F-134-C2-R0 is a highly efficient heat sink designed to be used in applications such as computers, LED lighting, power and motor control, and other industrial, commercial, and medical applications. The ATS-02F-134-C2-R0 is easily integrated into circuit boards in any standard or customized form factor and is compatible with most standard mounting practices.
The ATS-02F-134-C2-R0 is an excellent choice for any application that needs reliable and effective heat dissipation. This highly efficient heat sink promises to keep your electronic components cool even in the most challenging of environments. With its long-lasting, corrosion-resistant design, the ATS-02F-134-C2-R0 is ideal for any temperature-sensitive application.
The specific data is subject to PDF, and the above content is for reference